INCH-POUND
The documentation and process conversion measures
necessary to comply with this document shall be
MIL-PRF-19500/395K
completed by 11 November 2010.
20 September 2010
SUPERSEDING
MIL-PRF-19500/395J
6 December 2007
PERFORMANCE SPECIFICATION SHEET
* SEMICONDUCTOR DEVICE, TRANSISTOR, NPN, SILICON, SWITCHING,
TYPES 2N3735, 2N3735L, 2N3737, AND 2N3737UB, JAN, JANTX, JANTXV, JANS,
JANSM, JANSD, JANSP, JANSL, JANSR, JANSF, JANSG, AND JANSH
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
* 1.1 Scope. This specification covers the performance requirements for NPN, silicon, switching transistors. Four
levels of product assurance are provided for each device type as specified in MIL-PRF-19500 and two levels of
product assurance are provided for unencapsulated devices. Provisions for radiation hardness assurance (RHA) to
eight radiation levels is provided for JANTXV, JANS, JANHC, and JANKC product assurance levels. RHA level
designators "M", "D", "P", "L", "R", "F', "G" and "H" are appended to the device prefix to identify devices, which have
passed RHA requirements.
1.2 Physical dimensions. See figure 1 (TO-39 and TO-5), figure 2 (TO-46), and figure 3 (2N3737UB).
1.3 Maximum ratings. Unless otherwise specified, TC = +25°C.
TJ and
RθJC
RθJSP
RθJA
PT
Type
PT
PT
TSP =+25°C
TC =+25°C
TA = +25°C
TSTG
°C/W
°C/W
°C/mW
°C
W
W
W
2N3735, 2N3735L
1.0 (1)
2.9 (2)
N/A
175
60
N/A
-65 to +200
2N3737
0.5 (3)
1.9 (4)
N/A
350
88
N/A
-65 to +200
2N3737UB
0.5 (5)
N/A
1.9 (4)
325 (6)
N/A
88 (6)
-65 to +200
Types
VCBO
VCEO
VEBO
IC
V dc
V dc
V dc
A dc
2N3735, 2N3735L, 2N3737, 2N3737UB
75
40
5
1.5
Derate linearly at 5.71 mW/°C above TA = +25°C.
(1)
Derate linearly at 16.6 mW/°C above TC = +25°C.
(2)
Derate linearly at 2.86 mW/°C above TA = +25°C.
(3)
Derate linearly at 11.3 mW/°C above TC = +32.8°C.
(4)
Derate linearly at 3.07 mW/°C above TA = +37.5°C.
(5)
TA = +55°C for UB on printed circuit board (PCB), PCB = FR4 .0625 inch (1.59 mm) 1 - layer 1 Oz Cu,
(6)
horizontal, still air, pads (UB) = .034 inch (0.86 mm) x .048 inch (1.22 mm), RθJA with a defined thermal
resistance condition included is measured at PT = 500 mW.
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@dscc.dla.mil. Since
contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at https://assist.daps.dla.mil/.
AMSC N/A
FSC 5961
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