The documentation and process conversion
INCH-POUND
measures necessary to comply with this revision
MIL-PRF-19500/308D
shall be completed by 15 January 2013.
15 October 2013
SUPERSEDING
MIL-PRF-19500/308C
1 August 1999
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, POWER RECTIFIER, FAST-RECOVERY
TYPES 1N3909, 1N3910, 1N3911, 1N3912, 1N3913, R AND A VERSIONS
JAN, JANTX, AND JANTXV
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein
shall consist of this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for silicon, semiconductor fast recovery,
power rectifier diodes. Three levels of product assurance are provided for each device type as specified in MIL-PRF-
19500.
1.2 Physical dimensions. See figure 1 (DO-5).
1.3 Maximum ratings.
TSTG
TOP
VR
VRWM
IO 1/
If (surge)
trr
Types
at 1/120 s
TC = 100°C
TC = 100°C
°C
°C
V dc
V (pk)
A dc
A dc
ns
1N3909, R
50
50
30
300
200
-65
-65
1N3909A, AR
50
50
50
400
150
to +175
to +150
1N3910, R
100
100
30
300
200
1N3910A, AR
100
100
50
400
150
1N3911, R
200
200
30
300
200
1N3911A, AR
200
200
50
400
150
1N3912, R
300
300
30
300
200
1N3912A, AR
300
300
50
400
150
1N3913, R
400
400
30
300
200
1N3913A, AR
400
400
50
400
150
1/ Derate linearly, 2 percent of IO per °C for TC > 100°C.
Barometric pressure reduced (altitude operation): 8 mmHg.
1.4 Primary electrical characteristics. RθJC = 0.8°C/W maximum.
* Comments, suggestions, or questions on this document should be addressed to DLA Land and Maritime,
ATTN: VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to Semiconductor@.dla.mil. Since
contact information can change, you may want to verify the currency of this address information using the
ASSIST Online database at https://assist.dla.mil.
AMSC N/A
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