INCH-POUND
The documentation and process conversion measures
necessary to comply with this document shall be
MIL-PRF-19500/397J
completed by 4 May 2010.
4 February 2010
SUPERSEDING
MIL-PRF-19500/397H
17 June 2004
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, TRANSISTOR, PNP, SILICON,
TYPES 2N3743, 2N3743U4, 2N4930, 2N4930U4, 2N4931, AND 2N4931U4,
JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
The requirements for acquiring the product described herein shall consist of
this specification sheet and MIL-PRF-19500.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for PNP, silicon, high-voltage transistor.
Four levels of product assurance are provided for each device type as specified in MIL-PRF-19500. Two levels of
product assurance for die are provided for each unencapsulated device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1 (TO-39), figure 2 (U4), and figures 3 and 4 for JANHC and JANKC (die)
dimensions.
*
1.3 Maximum ratings. Unless otherwise specified, TA = +25°C.
RθJA
RθJPCB
RθJC
VCBO
TJ and
PT (1)
PT (1)
PT (1)
VEBO
VCEO
IC
Type
(2)
(2)
(2)
TC =
TPCB =
TA =
TSTG
+25°C
+25°C
+25°C
°C/W
°C/W
°C/W
W
W
W
V dc
V dc
mA dc
°C
V dc
175
30
2N3743
1.0
5
300
5
300
200
175
30
2N4930
1.0
5
200
5
200
200
175
30
2N4931
1.0
5
250
5
250
200
-65 to
175
15
2N3743U4
1.0
10
300
5
300
200
+200
175
15
2N4930U4
1.0
10
200
5
200
200
175
15
2N4931U4
1.0
10
250
5
250
200
* (1) For derating see figures 5, 6, 7, and 8.
* (2) For thermal impedance curves see figures 9, 10, and 11.
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
semiconductor@dscc.dla.mil. Since contact information can change, you may want to verify the currency of this
address information using the ASSIST Online database at https://assist.daps.dla.mil .
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