MIL-PRF-19500/211D
3.4.2 Processing exemptions. Suppliers to this specification are exempt from the following restrictions stated
in MIL-PRF-19500 regarding offshore wafer processing:
a. Beveling operation.
b. Isotropic etching of die surface.
c. Die attach operation which promotes any diffusion of metal alloy into silicon die.
3.5 Marking. Devices shall be marked as specified in MIL-PRF-19500.
* 3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.7 Electrical test requirements. The electrical test requirements shall be as specified in table I.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.2.1 Group E qualification. Group E qualification shall be performed herein for qualification or re-qualification only.
In case qualification was awarded to a prior revision of the associated specification that did not request the performance
of table III tests, the tests specified in table III herein that were not performed in the prior revision shall be performed on
the first inspection lot to this revision to maintain qualification.
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