MIL-PRF-19500/211D
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screening (see table E-IV
Measurement
of MIL-PRF-19500)
JANTX and JANTXV levels
1
Method 2073 of MIL-STD-750 may be used in lieu of method 2074 for
compression bonded devices only.
Thermal impedance (see 4.3.1).
3c
4
2,500 G; performed prior to installation of external lead.
10
Not applicable.
11
12
TC = 150°C; f = 60 Hz.
13
initial value, whichever is greater. ĆVFM = ±0.1 V (pk).
4.3.1 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
4081 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of MIL-PRF-19500,
table I herein, and as specified herein. Electrical measurements (end-points) and delta requirements shall be in
accordance with the applicable steps of table II herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and herein. Electrical measurements
(end-points) and delta requirements shall be in accordance with applicable steps of table II herein.
4.4.2.1 Group B inspection, table E-VIB (JAN, JANTX, and JANTXV of MIL-PRF-19500).
Subgroup
Method
Condition
B3
1048
or
f = 60 Hz.
B3
1037
RθJC = 0.20°C/W.
B5
4081
TA = +200°C.
B6
1032
5
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