MIL-PRF-19500/297H
4.3 Screening (JANTXV and JANTX levels only). Screening shall be in accordance with appendix E, table E-IV of
MIL-PRF-19500 and as specified herein. Specified electrical measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see appendix E,
JANTXV and JANTX level
table E-IV of
MIL-PRF-19500)
1a
Not required
1b
Required (JANTXV only)
2
Not required
3a
Required
3b
Surge (see 4.3.1)
(1) 3c
Thermal impedance (see 4.3.2)
4
Not applicable
5
Not applicable
6
Not applicable
7a
Optional
7b
Optional
8
Not required
9
VF2 and IR1 (2)
10
Not applicable
11
Not applicable
See 4.3.3
12
Subgroup 2 of table I herein; VF2 and IR1; ĆVF2 = .1 V(pk) from initial value;
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ĆIR1 = 100 percent of initial reading or ±5 µA dc, whichever is greater.
14a
Required
14b
Required
15
Not required
16
Not required
(1) Surge shall precede thermal response. These tests shall be performed anytime after screen 3 and
before screen 9.
(2) IR1 measurement shall not be indicative of an open condition.
4.3.1 Surge current. Surge current, method 4066 of MIL-STD-750. IO = 0; VRM(W) = 0; IFSM = 500 A; six surges;
TA = 25°C; tp = 8.3 ms; one minute minimum time between surges.
NOTE: A shorter time between surges will be allowed as long as it can be demonstrated that ĆTJ ≤ 10°C, as
measured immediately prior to the first current pulse and immediately after the final current pulse.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3101 of MIL-STD-750. The thermal impedance conditions and maximum thermal impedance limit shall be derived by
each vendor. The chosen thermal impedance measurement and conditions for each device in the qualification lot
shall be submitted in the qualification report and a thermal impedance curve shall be plotted. The chosen thermal
impedance values shall be considered final after the manufacturer has had the opportunity to test five consecutive
lots. Heating current (IH) ≥ rated IO; tH = 150 to 400 ms; tMD = 50 to 300 µs; 50 mA ≤ IM ≤` 250 mA.
4.3.3 Power burn-in. Power burn-in conditions are as follows: Method 1038 of MIL-STD-750, condition A, t = 48
hours.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
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