MIL-PRF-19500/466C
* 4.3 Screening (JANTX and JANTXV levels). Screening shall be in accordance with table IV of MIL-PRF19500,
and as specified herein. The following measurements shall be made in accordance with table I herein. Devices that
exceed the limits of table I herein shall not be acceptable.
Screen (see table IV
Measurement
of MIL-PRF-19500)
JANTX and JANTXV levels
(1) 3c
Thermal impedance (see 4.3.2)
ICEX1 and hFE2
11
12
See 4.3.1
13
Subgroup 2 of table I herein;
ĆICEX1 = ±100 percent of initial value or 1.0
µA dc, whichever is greater.
ĆhFE = ±25 percent of initial value
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be
repeated in screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: Adjust PT to achieve TJ = +187.5°C
± 12.5°C, VCB ≥ 10 V dc.
* 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 µs max. See table III, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
* 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein. Electrical measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
* 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and 4.4.2.1 herein. Electrical
measurements (end-points) shall be in accordance with table I, subgroup 2 herein. Delta measurements shall be in
accordance with table II herein.
4.4.2.1 Group B inspection, table VIb (JAN, JANTX and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Condition
For solder die attach, VCB ≥ 10 V dc, 2,000 cycles. No heat sink shall be
B3
1037
permitted.
For eutectic die attach adjust PT to achieve +175°C minimum. VCB ≥ 10 V
B3
1026
dc, TA ≤ +35°C
5
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