MIL-PRF-19500/508D
3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall
be as specified in MIL-PRF-19500 and figure 1 (TO-204 similar to TO-3).
3.3.1 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750 and herein.
Where a choice of lead finish is desired, it shall be specified in the contract or purchase order (see 6.2).
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I.
3.7 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4.VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Measurements
Screen (see table E-IV
of MIL-PRF-19500)
JANTX and JANTXV levels
11
ICEX1 and hFE1
12
See 4.3.1
13
Subgroup 2 of table I herein;
ĆICEX1 = 100 percent of initial value or
2 µA dc, whichever is greater;
ĆhFE1 = ±25 percent of initial value
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: TJ = +187.5°C ±12.5°C; VCB ≥ 20 V dc;
TA ≤ +35°C. NOTE: No heat sink or forced air cooling on the devices shall be permitted.
5
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