MIL-PRF-19500/508D
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table E-V of
MIL-PRF-19500 and table I herein. Electrical measurements (end-points) shall be in accordance with table I,
subgroup 2 herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VIB (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and herein. Electrical
measurements (end-points) shall be in accordance with table I, subgroup 2 herein.
Subgroup
Method
Condition
For solder die attach: VCB ≥ 20 V dc; 2,000 cycles; TA ≤ +35°C.
B3
1037
For eutectic die attach: TA ≤ +35°C, VCB ≥ 20 V dc adjust PT to achieve
B3
1027
TJ = +175°C minimum.
See 4.5.2.
B5
3131
* 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
Subgroup
Method
Condition
*
C2
2036
Condition A, weight = 10lbs, time = 15 seconds.
For solder die attach: VCB ≥ +20 V dc; 6,000 cycles; TA ≤ +35°C.
C6
1037
For eutectic die attach: TA ≤ +35°C, VCB ≥ 20 V dc adjust PT to achieve
C6
1027
TJ = +175°C minimum.
4.5 Method of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
* 4.5.2 Thermal resistance Thermal resistance measurements shall be conducted in accordance with method
3131 of MIL-STD-750. The following details shall apply: RθJC = 0.875°C/W.
a. IM ..............................................................................................20 mA.
b. VCE ............................................................................................10 V dc.
c. IH collector heating current ........................................................4.0 A min.
d. VH collector-emitter heating voltage ..........................................10 V dc.
e. th heating time ...........................................................................1 s (min).
f. tmd measurement delay time ......................................................50 - 80 µs.
g. tsw sample window time .............................................................10 µs maximum.
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