MIL-PRF-19500/621D
4.3.2 Thermal impedance (ZθJX measurements). The ZθJX measurements shall be performed in accordance with
method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tMD, and VC where
appropriate. The ZθJX limit used in screen 3c shall comply with the thermal impedance graph on figure 3 (less than or
equal to the curve value at the same tH time) and/or shall be less than the process determined statistical maximum
limit as outlined in method 3131.
*
4.3.3 Dielectric withstanding voltage.
a.
Magnitude of test voltage...................................900 V dc.
b.
Duration of application of test voltage....................15 seconds (min).
c.
Points of application of test voltage........................All leads to case (bunch connection).
d.
Method of connection.........................................Mechanical.
e.
Kilovolt-ampere rating of high voltage source..........1,200 V/1.0 mA (min).
f.
Maximum leakage current....................................1.0 mA.
g.
Voltage ramp up time...................................................500 V/second.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with appendix E, table E-V of
MIL-PRF-19500, and table I herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for
subgroup testing in tables E-VIa and E-VIb of MIL-PRF-19500. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
4.4.2.1 Group B inspection table E-VIa (JANS) of MIL-PRF-19500.
Subgroup
Method
Conditions
VCB ≥ -10 V dc.
B4
1037
*
B5
2037
Bond strength, test condition A.
B6
3131
See 4.5.2.
4.4.2.2 Group B inspection table E-VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
Method
Conditions
VCB ≥ -10 V dc.
B3
1037
*
B5
3131
See 4.5.2.
TA = +200°C.
B6
1032
5
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