MIL-PRF-19500/626A
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing on
the applicable qualified products list before contract award (see 4.2 and 6.3).
3.2 Associated detail specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified
herein.
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-
19500.
3.4 Design, construction, and physical dimensions. The design, construction, and physical dimensions for the purpose of
interchangeability shall be as specified on figures 1 and 2 herein. The US government's preferred system of measurement is the metric
SI system. However, since this item was originally designed using inch-pound units of measurement, in the event of conflict between the
metric and inch-pound units, the inch-pound units shall take precedence.
3.4.1 Diode construction. These devices shall be constructed utilizing non-cavity double plug construction with metallurgical bonding
between both sides of the silicon die and terminal pins (see MIL-PRF-19500). Metallurgical bond shall be in accordance with the
requirements of category 1 in MIL-PRF-19500. -US version devices shall be structurally identical to the non-surface mount devices
except for lead terminations.
3.4.2 Lead formation and finish. Unless otherwise specified lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-
750, and herein.
3.4.3 Polarity. Polarity shall be marked with a contrasting band or dot on the cathode side of the diode body.
3
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business