MIL-PRF-19500/177H
3.7 Marking. Marking shall be in accordance with MIL-PRF-19500.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
4.3 Screening (JANTX level only). Screening shall be in accordance with table E-IV of MIL-PRF-19500 and as
specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed
the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurements
of MIL-PRF-19500)
JANTX and JANTXV levels only
(1) 3c
Thermal impedance method 3131 of MIL-STD-750 (see 4.3.2)
9
Not applicable
11
ICBO1 and hFE2
See 4.3.1
12
ĆICBO1 = 100 percent of initial value or 1 µA dc whichever is
greater; ĆhFE2 = ±20 percent of initial value; subgroup 2 of table I
13
herein
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be repeated in
screening requirements.
4
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