MIL-PRF-19500/358F
* 3.4.2 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-
STD-750, and
herein. Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
* 3.4.3 RB types. Reverse (cathode to stud) units shall be marked with an R preceding the B in the type designation
(RB suffix).
3.5 Marking. Marking shall be in accordance with MIL-PRF-19500.
* 3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
* 3.7 Electrical test requirements. The electrical test requirements shall be as specified in table I.
* 3.8 Maximum and primary test ratings. Maximum and primary test ratings for voltage regulator diodes are
specified in table III herein.
* 3.9 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4, and tables I, II, and III).
4.1.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-PRF-19500, and as
specified herein. Lot accumulation period shall be 6 months in lieu of 6 weeks.
* 4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500 and as specified
herein.
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