MIL-PRF-19500/395K
4.3 Screening (JANTX, JANTXV and JANS levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANS level
JANTX and JANTXV levels
(1) 3c
Thermal impedance, method 3131 of
Thermal impedance, method 3131 of
MIL-STD-750 (see 4.3.2).
MIL-STD-750 (see 4.3.2).
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ICBO2 and hFE3.
Not applicable.
11
ICBO2; hFE3;
ICBO2 and hFE3.
ĆICBO2 = 100 percent or 25 nA dc,
whichever is greater;
ĆhFE3 = ±15 percent of initial value.
12
See 4.3.1.
See 4.3.1.
13
Subgroups 2 and 3 of table I herein;
Subgroup 2 of table I herein;
ĆICBO2 = 100 percent or 25 nA dc,
ICBO2 = 100 percent or 25 nA dc,
whichever is greater;
whichever is greater;
ĆhFE3 = ±15 percent of initial value.
ĆhFE3 = ±15 percent of initial value.
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be repeated in
screening requirements.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB = 10 - 30 V dc. Power shall be
applied to achieve TJ = +135°C minimum using a minimum PD = 75 percent of PT maximum, TA ambient rated as
defined in 1.3. NOTE: No heat sink or forced air cooling on the devices shall be permitted. With approval of the
qualifying activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, and mounting conditions)
may be used for JANTX and JANTXV quality levels. A justification demonstrating equivalence is required. In
addition, the manufacturing site's burn-in data and performance history will be essential criteria for burn-in
modification approval.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with
method 3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW (and VH where
appropriate). The thermal impedance limit used in screen 3c and table I, subgroup 2 shall be set statistically by the
supplier. See table IV, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein. If alternate screening is being performed in accordance with MIL-PRF-19500, a sample of screened
devices shall be submitted to and pass the requirements of subgroups 1 and 2 of table I herein, inspection only
(table E-VIB of MIL-PRF-19500, group B, subgroup 1 is not required to be performed since solderability and resistance
to solvents testing is performed in table I herein).
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500, and table I
herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the tests and conditions
specified for subgroup testing in table E-VIA (JANS) of MIL-PRF-19500 and table E-VIB (small die flow, JAN, JANTX,
and JANTXV). Electrical measurements (end-points) and delta requirements shall be in accordance with table I,
subgroup 2 and table II herein; delta requirements only apply to subgroups B4 and B5. See table E-VIC of
MIL-PRF-19500 and 4.4.2.2 for JAN, JANTX, and JANTXV group B testing. Electrical measurements (end-points)
and delta requirements for JAN, JANTX, and JANTXV shall be after each step in 4.4.2.2 and shall be in accordance
with table I, subgroup 2 and table II herein.
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