MIL-PRF-19500/412F
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for
subgroup testing in table E-VII of MIL-PRF-19500 and as follows. Electrical measurements (end-points) shall be in
accordance with table I, subgroup 2 herein.
Subgroup
Method
Condition
C2
1056
Test condition B.
C2
2036
Test condition A, for 2N3846 and 2N3847, weight = 7 lbs ±5 ounces, t = 15 seconds,
tubulated leads only; for 2N3846T1, 2N3846T3, 2N3847T1, and 2N3847T3,
weight = 4.5 kg, t = 10 seconds.
C2
2036
Test condition D2, 2N3846 and 2N3847 only, torque = 30 inch-pounds, t = 30 seconds.
C2
2036
Test condition D1, 2N3846 and 2N3847 only, torque = 6 inch-ounces, t = 15 seconds.
3131 See 4.3.2, RθJC = 1.3°C/W for 2N3846, 2N3846T1, 2N3847, and 2N3847T1,
C5
RθJC = 1.0°C/W for 2N3846T3 and 2N3847T3.
C6
1037
For solder die attach: 6,000 cycles, VCB ≥ 20 V dc.
C6
1026
For eutectic die attach: VCB ≥ 20 V dc, adjust PT or TA to achieve TJ = +175°C minimum,
TA ≤ +35°C.
4.4.4 Group E inspection. Group E inspection shall be conducted in accordance with the conditions specified for
subgroup testing in appendix E, table E-IX of MIL-PRF-19500 and as specified herein. Electrical measurements
(end-points) shall be in accordance with table I, subgroup 2 herein.
4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate tables and as follows.
4.5.1 Pulse measurements. Conditions for pulse measurement shall be as specified in section 4 of
MIL-STD-750.
4.5.2 Burnout by pulsing. This test shall be conducted in a circuit capable of supplying the specified pulse
conditions to the transistor under test. Good engineering practices shall be utilized to eliminate inductive effects in
the circuitry and power supply. Rise and fall times of the pulse shall be less than 10 percent of the specified tp.
Non-inductive monitoring techniques shall be utilized and the value of any monitoring resistor shall be less than
VCC/ (20 IC).
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