MIL-PRF-19500/446E
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
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Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
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Test Methods for Semiconductor Devices.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or
https://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
* 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
MIL-PRF-19500 and on figure 1 herein.
3.4.1 Internal construction. The rectifier bridge shall consist of a metal and plastic encased assembly of discrete
diodes. Each discrete diode shall be a glass-to-metal, ceramic-to-metal, or fused metal oxide-to-metal hermetically
sealed package. No multiple diodes for each leg construction shall be permitted. The silicon die in each discrete
diode shall be metallurgically bonded directly to the terminal pins. The completed assembly of diodes and other
internal structures shall be encapsulated in a plastic material which polymerizes to a rigid condition by virtue of a
chemical cross-linking mechanism. The rectifier bridge shall be free of voids either visible or as evidenced by failure
to pass the environment test specified herein. Only those discrete diodes which have met these requirements shall
be used in the rectifier bridge. Discrete diodes shall be manufactured and tested by the rectifier bridge manufacturer.
3.4.2 Terminal finish. Terminal finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and
herein. Where a choice of terminal finish is desired, it shall be specified in the acquisition document (see 6.2).
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