MIL-PRF-19500/467A
3.4.2 Terminal lead length. Terminal lead lengths other than that specified on figures 1 and 2 may be furnished
when so stipulated in the acquisition document (see 6.2) where the devices covered herein are required directly for
particular equipment-circuit installation or for automatic-assembly-technique programs.
3.5 Marking. Devices shall be marked as specified in MIL-PRF-19500.
3.6 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
characteristics are as specified in 1.3, 1.4, and table I herein.
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I
herein.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.3 Screening (JANTX level only). Screening shall be in accordance with table E-IV of MIL-PRF-19500 and as
specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed
the limits of table I herein shall not be acceptable.
Screen
Measurements
(see table E-IV of
MIL-PRF-19500)
JANTX level
2
As given, except condition shall be 24 hours minimum at maximum
rated storage temperature.
Tupper extreme =100°C, +0°C, -3°C.
3a
7
As given, except for the fine leak test, condition G, testing 2 hours after
pressurization is acceptable and for the gross leak test, the device
temperature shall be maintained at 100°C ±5°C.
9 and 10
Not applicable.
11
IV1, VF
IF = 50 mA dc; TA = +25°C, t = 96 hours.
12
Subgroup 2 of table I herein; ΔIV1 = -20 percent of initial readings.
13
ΔVF =±50 mV dc.
4
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