MIL-PRF-19500/467A
TABLE I. Group A inspection.
Unit
MIL-STD-750
Limits
Symbol
Inspection 1/
Min
Max
Method
Conditions
Subgroup 1
2071
Visual and mechanical
inspection
Subgroup 2
Θ = 0 degrees (see 4.5.1)
mcd
3.0
0.5
IV1
Luminous intensity
IF = 20 mA dc
Θ = 30 degrees; IF = 20 mA dc
Luminous intensity
IV2
0.3
mcd
μA dc
Reverse current
4016
DC method; VR = 3 V dc
IR
1.0
Forward voltage
4011
DC method, IF = 20 mA dc
VF
2.0
V dc
Subgroup 3
TA = +100°C
High temperature:
Θ = 0 degrees, IF = 20 mA dc
Luminous intensity
IV1
0.45
3.0
mcd
Subgroup 4
4001
VR = 0; f = 1 MHz
C
300
pF
Capacitance
1/ For sampling plan, see MIL-PRF-19500.
5. PACKAGING
* 5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or
order (see 6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these
personnel need to contact the responsible packaging activity to ascertain packaging requirements. Packaging
requirements are maintained by the Inventory Control Point's packaging activities within the Military Service or
Defense Agency, or within the Military Service's system commands. Packaging data retrieval is available from the
managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by
contacting the responsible packaging activity.
6. NOTES
* (This section contains information of a general or explanatory nature that may be helpful, but is not mandatory.
The notes specified in MIL-PRF-19500 are applicable to this specification.)
* 6.1 Intended use. Semiconductors conforming to this specification are intended for original equipment design
applications and logistic support of existing equipment.
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