MIL-PRF-19500/498E
4. VERIFICATION
4.1 Classification of inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3).
*
c. Conformance inspection (see 4.4 and table I).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500, and as
specified herein.
* 4.2.1 Group E qualification. Group E inspection shall be performed for qualification or re-qualification only. In
case qualification was awarded to a prior revision of the specification sheet that did not request the performance of
table II tests, the tests specified in table II herein that were not performed in the prior revision shall be performed on
the first inspection lot of this revision to maintain qualification.
* 4.3 Screening. Screening shall be in accordance with table IV of MIL-PRF-19500 and as specified herein. The
following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I
herein shall not be acceptable.
Screen (see table IV
Measurements
of MIL-PRF-19500)
JANTX, JANTXV levels
3c
Thermal impedance (transient), method 3131 of MIL-STD-750 (see 4.3.2) (1)
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Optional.
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ICEX1 and hFE3
12
See 4.3.1
13
Subgroup 2 of table I herein;
ĆICEX1 ≤ 100 percent of initial value or 500 nA dc, whichever is greater.
ĆhFE3 ≤ 25 percent of initial value.
14
Required.
(1) Thermal impedance (ZθJX) limits shall not exceed figures 7, 8, or 9. This test shall be performed anytime
after temperature cycling, screen 3a, and does not need to be repeated in screening requirements.
* 4.3.1 Power burn-in conditions. Power burn-in conditions are: TJ = + 175°C minimum, VCB = 10 - 30 V dc;
TA = +30°C maximum.
* 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of Mil-Std-750 using the guidelines in that method for determining IM, IH, tH, tMD (and VC where appropriate).
The thermal impedance limit used in screen 3c of 4.3 herein and table I shall comply with the thermal impedance
graph in figure 7, 8, or 9 (less than or equal to the curve value at the same tH time) and shall be less than the process
determined statistical maximum limit as outlined in method 3131.
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