MIL-PRF-19500/500E
2.2 Government documents.
* 2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
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Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
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Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the
Document Automation Production Services (DAPS), 700 Robbins Avenue, Building 4D (DPM-DODSSP),
Philadelphia, PA 19111-5094).
* 2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500 and as follows: I(BR) - reverse breakdown current at a specified condition.
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
MIL-PRF-19500, and on figure 1 (DO-13) herein.
3.4.1 Metallurgically bonded construction. Metallurgically bonded construction is required. The bonding flow shall
have flow points above 260C.
3.4.2 Lead finish. Lead finish shall be solderable in accordance with MIL-PRF-19500, MIL-STD-750, and herein.
Where a choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.5 Marking. Devices shall be marked in accordance with MIL-PRF-19500.
3.6 Electrical performance characteristics. Unless otherwise specified, the electrical performance characteristics
are as specified in 1.3, 1.4, and table I. Maximum ratings shall be in accordance with columns 6 through 8 of table II.
Primary electrical characteristics are shown in columns 4 and 5 of table II herein.
3.7 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I,
subgroup 2.
3.8 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
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