MIL-PRF-19500/526H
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500 and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Measurement
Screen (see table E-IV
of MIL-PRF-19500)
JANTX and JANTXV levels
Thermal impedance (see 4.3.2).
(1) 3c
9
ICEX1.
11
hFE2; ICEX1;
ĆICEX1 = 100 percent of initial value or 2 µA dc, whichever is
greater.
See 4.3.1.
12
13
Subgroup 2 of table I herein.
ĆICEX1 = 100 percent of initial value or 2 µA dc, whichever is
greater.
ĆhFE2 = ±25 percent of initial value.
(1) Shall be performed anytime after temperature cycling, screen 3a; and does not need to be
repeated in screening requirements.
4.3.1 Power burn-in. Power burn-in conditions are as follows: TJ = +187.5°C, ±12.5°C; VCB = 10 - 30 V dc;
TA = room ambient as defined in the general requirements of 4.5 of MIL-STD-750. With approval of the qualifying
activity and preparing activity, alternate burn-in criteria (hours, bias conditions, TJ, and mounting conditions) shall be
used. A justification demonstrating equivalence is required. In addition, the manufacturing site's burn-in data and
performance history will be essential criteria for burn-in modification approval.
4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as
specified herein.
5
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