MIL-PRF-19500/583B
4.3 Screening (JANTX and JANTXV levels only). Screening shall be in accordance with table E-IV of
MIL-PRF-19500, and as specified herein. The following measurements shall be made in accordance with table I
herein. Devices that exceed the limits of table I herein shall not be acceptable.
Screen (see table E-IV
Measurement
of MIL-PRF-19500)
JANTX and JANTXV level
(1)
Method 3131 (see 4.3.2)
ICBO, and hFE2
11
12
See 4.3.1
13
Subgroup 2 of table I herein;
ĆICBO = 100 percent of initial value, or 10 nA dc
whichever is greater;
ĆhFE2 = ± 15percent of initial value.
(1) Shall be performed anytime before screen 10.
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows: VCB ≥ 20 V dc; PT = 1.0 W at TA = 30°C
±5°C. NOTE: No heat sink or forced air cooling on the devices shall be permitted.
* 4.3.2 Thermal impedance. The thermal impedance measurements shall be performed in accordance with method
3131 of MIL-STD-750 using the guidelines in that method for determining IM, IH, tH, tSW, (and VH where appropriate).
Measurement delay time (tMD) = 70 µs max. See table III, group E, subgroup 4 herein.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500, and as
specified herein. Alternate flow is allowed for quality conformance inspection in accordance with MIL-PRF-19500.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with table I herein.
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