MIL-PRF-19500/623D
2. APPLICABLE DOCUMENTS
* 2.1 General. The documents listed in this section are specified in sections 3 or 4 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3 or 4 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
-
Test Methods for Semiconductor Devices.
* (Copies of these documents are available online at https://quicksearch.dla.mil/).
2.3 Order of precedence. Unless otherwise noted herein or in the contract, in the event of a conflict between the
text of this document and the references cited herein, the text of this document takes precedence. Nothing in this
document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
3.4 Interface and physical dimensions. The interface and physical dimensions shall be as specified in
MIL-PRF-19500 and on figure 1. Methods used for electrical isolation of the terminal feedthroughs shall employ
materials that contain a minimum of 90 percent ceramic AL2O3 or equivalent. Examples of such construction
techniques are metallized ceramic eyelets or ceramic walled packages.
3.4.1 Lead finish. Lead finish shall be solderable in accordance with MIL-STD-750, MIL-PRF-19500, and herein.
Where a choice of lead finish or formation is desired, it shall be specified in the acquisition requirements (see 6.2).
When lead formation is performed, as a minimum, the vendor shall perform 100 percent hermetic seal in accordance
with table E-IV, screen 14, of MIL-PRF-19500.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance
3
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business