MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX E

ESDS classification levels are defined as follows:

Prior

Individual

ESDS class

designation

part

Package

Electrostatic

designator 1/

category

marking

voltage

Ć0

<250 V

ĆA

250 - 499V

ĆB

500 - 999 V

ĆC

1,000 - 1,999 V

ĆĆ

2,000 - 3,999 V

ĆĆĆA

4,000 V - 7,999 V

ĆĆĆB

8,000 V � 15,999

Non-sensitive

> 15,999 V

E.4.2.1.1 ESDS. ESDS classification testing shall be done in accordance with test method 1020 of MIL-STD-750

and the applicable specification sheet (see 3.10.3.1). Devices shall be handled in accordance with the

manufacturer's in-house control documentation. Devices that are classified non-sensitive are not required to be

handled as ESD sensitive, and manufacturer's in-house control documentation plan is not required. Handling shall

begin at lead clip or wire bond (e.g., for packages which do not have a lead shorting bar or do not have leads shorted

together). Guidance for device handling is available in the JESD-625 document.

E.4.2.2 Qualification by extension. Qualification of a structurally identical device, a series of devices from the

same or different specification sheets, or qualification of a new package for a previously qualified die may be

extended from a previously fully qualified device provided the following information and data are supplied to the

qualifying activity:

Previously qualified device type, specification sheet number, and qualification reference number. When

qualifying by extension, thermal impedance data shall be submitted for all specification sheets, in addition to

the specification sheet the qualification testing was performed on.

Design and construction information on devices covered under different specification sheets.

Samples of structurally identical devices with certification that these samples are structurally identical to the

previously qualified device.

ESD class designator 1 has been replaced with designators 0, 1A, 1B, and 1C; and ESD class designator 3 has

been replaced by 3A and 3B ESD class designators as of 30 May 2006. Devices not yet ESD re-classified may

continue to be marked as class 1, 2, or 3 until testing determines the appropriate class. The manufacturer may

test and mark the tested level obtained under the column titled "Individual Park Marking". After 30 May 2006 (for

newly qualified products) the 1A, 1B, 1C, 2, 3A, and 3B designators shall be used and all currently qualified

devices specified in the current revision of 19500 QML as ESD classes 1 or 3 shall be ESD tested by the

respective manufacturers to determine correct device ESD classification within 1 year after this revision has been

dated. Prior designation category devices previously classified by test as category B may be marked as class 2

(ĆĆ).