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MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

CONTENTS

PAGE

PARAGRAPH

D.3.13.2.3 Rework of assembled devices.....................................................................................................73

D.3.13.2.3.1 Irradiation of assembled devices ..........................................................................................73

D.3.13.3 Rejected lots ......................................................................................................................................73

D.3.14 Corrective and preventive action ..............................................................................................................73

D.3.14.1 Corrective action ................................................................................................................................73

D.3.14.2 Preventive action ...............................................................................................................................73

D.3.15 Handling, storage, packaging, and delivery..............................................................................................74

D.3.15.1 Security of completed devices ...........................................................................................................74

D.3.15.2 Electrostatic discharge sensitive (ESDS) program.............................................................................74

D.3.16 Quality records .........................................................................................................................................74

D.3.17 Internal quality audits................................................................................................................................74

D.3.17.1 Internal audit program........................................................................................................................74

D.3.17.1.1 Internal audit checklist .................................................................................................................74

D.3.17.2 Audit schedules and frequencies .......................................................................................................74

D.3.17.3 Auditors..............................................................................................................................................74

D.3.17.4 Audit deficiencies ...............................................................................................................................75

D.3.18 Training ....................................................................................................................................................75

D.3.18.1 Personnel performing quality operations............................................................................................75

D.3.18.2 Training requirements ........................................................................................................................75

D.3.19 Servicing...................................................................................................................................................75

D.3.20 Statistical techniques................................................................................................................................75

D.3.20.1 SPC program. ....................................................................................................................................75

STANDARD VERIFICATION SYSTEM FOR QUALIFED PRODUCTS .......................................................................77

E.1 SCOPE..............................................................................................................................................................77

E.1.1 Scope .........................................................................................................................................................77

E.2 APPLICABLE DOCUMENTS ............................................................................................................................77

E.2.1 General.......................................................................................................................................................77

E.2.2 Non-Government publications ....................................................................................................................77

E.2.3 Order of precedence...................................................................................................................................77

E.3 GENERAL TEST AND INSPECTION INFORMATION......................................................................................78

E.3.1. Wafer lots ..................................................................................................................................................78

E.3.1.1 Formation of inspection lots .................................................................................................................78

E.3.1.1.1 JAN, JANTX, and JANTXV inspection lot ......................................................................................78

E.3.1.1.1.1 Inspection sublot .....................................................................................................................78

E.3.1.2 JANS lots .............................................................................................................................................78

E.3.1.2.1 Scanning electron microscope (SEM) inspection ..........................................................................78

E.3.1.2.2 JANS inspection lots......................................................................................................................79

E.3.2 Structurally identical device types...............................................................................................................79

E.3.3 Disposal of samples....................................................................................................................................80

E.3.4 Destructive tests .........................................................................................................................................80

E.3.5 Nondestructive tests ...................................................................................................................................81

E.3.6 Resubmitted lots .........................................................................................................................................82

E.3.6.1 Resubmitted lots of JAN, JANTX, JANTXV, and JANS........................................................................82

E.3.6.2 Resubmitted lots of RHA devices.........................................................................................................82

E.3.7 Conditions and methods of test ..................................................................................................................82

E.3.7.1 Alternative test methods.......................................................................................................................82

E.3.7.1.1 In line conformance inspection ......................................................................................................82

E.3.7.2 Procedure in case of test equipment failure or human error ................................................................82

E.3.7.2.1 Particle impact noise detector (PIND) test equipment failure or error............................................83

E.3.7.3 Standard mixer diodes and holders......................................................................................................83

E.3.8 JANS electrical test data.............................................................................................................................83

E.3.8.1 Summary of parts fallout ......................................................................................................................83

E.3.9 Preservation of lot identity ..........................................................................................................................83

E.4 VERIFICATION .................................................................................................................................................83

E.4.1 Qualification inspection...............................................................................................................................83