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MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

CONTENTS

PAGE

PARAGRAPH

C.4.3 TRB input ...................................................................................................................................................52

C.4.4 TRB authority .............................................................................................................................................53

C.4.5 TRB status reporting...................................................................................................................................53

C.5 QUALITY PLANNING .......................................................................................................................................54

C.5.1 Product quality planning .............................................................................................................................54

C.5.1.1 Technology process flowchart ..............................................................................................................54

C.5.2 FMEA. ........................................................................................................................................................54

C.5.3 Control plans ..............................................................................................................................................54

C.6. QM CERTIFICATION.......................................................................................................................................54

C.6.1 QM program certification process...............................................................................................................54

C.7 CHANGE PROCEDURES ................................................................................................................................55

C.7.1 Design, construction and process change control procedures ...................................................................55

C.7.1.1 Change notification ..............................................................................................................................55

C.7.2 Design and process methodology change..................................................................................................55

C.8. QUALIFICATION, VALIDATION, OPTIMIZATION, AND CONTINUOUS IMPROVEMENT.............................55

C.8.1 QML processing .........................................................................................................................................55

C.8.1.1 Design qualification..............................................................................................................................55

C.8.1.1.1 General elements of a design qualification program ......................................................................56

C.8.1.2 Detailed elements of a design qualification program............................................................................56

C.8.2 Process optimization ..................................................................................................................................56

C.8.2.1 Test optimization..................................................................................................................................57

C.8.2.2 Methods of test optimization ................................................................................................................57

C.8.3 Process validation: On-going reliability or conformance inspection ...........................................................57

C.8.3.1 On-going reliability guidance criteria .....................................................................................................57

C.8.3.1.1 General elements of an on-going reliability program ......................................................................57

C.8.4 Continuous improvement............................................................................................................................58

C.8.4.1 Quality and productivity improvement ..................................................................................................58

C.8.4.2 Measures and methodologies ..............................................................................................................58

C.8.5 Qualification................................................................................................................................................59

C.9 Maintaining QM program certification. ..............................................................................................................59

C.10 Removal of TRB authority ...............................................................................................................................59

QUALITY SYSTEM ......................................................................................................................................................60

D.1 SCOPE .............................................................................................................................................................60

D.1.1 Scope .........................................................................................................................................................60

D.2 APPLICABLE DOCUMENTS ............................................................................................................................60

D.2.1 General.......................................................................................................................................................60

D.2.2 Non-Government publications ....................................................................................................................60

D.2.3 Order of precedence...................................................................................................................................61

D.3 REQUIREMENTS .............................................................................................................................................61

D.3.1 Responsibility and authority........................................................................................................................61

D.3.1.1 Basic and contracted plant requirements. ...............................................................................................61

D.3.1.1.1 Definition of a manufacturer ..........................................................................................................61

D.3.1.1.1.1 Basic plant ..............................................................................................................................61

D.3.1.1.1.2 Contracted plant .....................................................................................................................61

D.3.1.1.1.2.1 Contracted assembly plant...............................................................................................61

D.3.1.1.1.2.2 Contracted wafer fabrication plant....................................................................................61

D.3.1.1.1.3 Wafer fabrication.....................................................................................................................62

D.3.1.2 Responsibility of the manufacturer.......................................................................................................62

D.3.1.3 Management responsibility ..................................................................................................................62

D.3.1.3.1 Personnel ......................................................................................................................................62

D.3.1.3.2 Resources .....................................................................................................................................62

D.3.1.4 Organization ........................................................................................................................................62

D.3.1.4.1 Management representative..........................................................................................................62

D.3.1.5 Management review.............................................................................................................................63

D.3.1.5.5 Qualified Products Technical Review Board (QPTRB) ..................................................................63