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MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

CONTENTS

PAGE

PARAGRAPH

E.4.2 Inspection routine .......................................................................................................................................84

E.4.2.1 Qualification to electrostatic discharge sensitivity (ESDS) classes ......................................................84

E.4.2.1.1 ESDS.............................................................................................................................................85

E.4.2.2 Qualification by extension ....................................................................................................................85

E.4.3 End-points. .................................................................................................................................................86

E.4.4 Selection of samples...................................................................................................................................86

E.4.5 Identification of samples .............................................................................................................................86

E.4.6 Qualification inspection lot release. ............................................................................................................86

E.5 SCREENING.....................................................................................................................................................87

E.5.1 Screening ...................................................................................................................................................87

E.5.2 Percent defective allowable (PDA ..............................................................................................................87

E.5.2.1 JANTX and JANTXV PDA.....................................................................................................................87

E.5.2.2 JANS PDA ...........................................................................................................................................87

E.5.3 JANTX and JANTXV product......................................................................................................................87

E.5.3.1 Alternate procedure for screening of JANTX and JANTXV types. .......................................................88

E.5.3.2 Bin and cell pre and post burn-in electrical measurements..................................................................88

E.5.3.3 Alternate procedures for qualification and conformance inspection where JAN is not covered by the

specification sheet .............................................................................................................................................88

E.5.3.4 Lead forming for JANTX and JANTXV ................................................................................................88

E.5.4 JANS product .............................................................................................................................................88

E.5.4.1 PIND test for JANS devices .................................................................................................................88

E.5.4.2 Lead forming for JANS .........................................................................................................................89

E.5.4.3 Burn-in socket verification for JANS.....................................................................................................89

E.5.5 Failure evaluation for JANS ........................................................................................................................89

E.6 CONFORMANCE INSPECTION .......................................................................................................................94

E.6.1 Conformance inspection .............................................................................................................................94

E.6.1.1 Nonconformance..................................................................................................................................94

E.6.2 Group A inspection .....................................................................................................................................94

E.6.3 Group B inspection .....................................................................................................................................94

E.6.3.1 Lots shipped prior to group B completion.............................................................................................95

E.6.4 Group C inspection .....................................................................................................................................95

E.6.4.2 Lots shipped prior to group C completion.............................................................................................95

E.6.5 Group D inspection .....................................................................................................................................96

E.6.6 Group E inspection .....................................................................................................................................96

E.6.6.1 Group E testing requirements ..............................................................................................................96

E.6.6.2 Alternate group E testing procedures...................................................................................................96

E.6.7 Groups B, C, D, and E end-points ..............................................................................................................96

MIL-PRF-19500M, appendix F, dated 22 October 1999, is hereby canceled without replacement............................123

DISCRETE SEMICONDUCTOR DIE/CHIP LOT ACCEPTANCE ..............................................................................125

G.1 SCOPE ...........................................................................................................................................................125

G.1.1 Scope .......................................................................................................................................................125

G.2 APPLICABLE DOCUMENTS ..........................................................................................................................125

G.3 DEFINITIONS .................................................................................................................................................125

G.3.1 Date code.................................................................................................................................................125

G.3.2 Die/chips ..................................................................................................................................................125

G.3.3 Manufacturer. ...........................................................................................................................................125

G.3.4 Identification .............................................................................................................................................125

G.3.5 Wafer lot...................................................................................................................................................125

G.3.6 Inspection lot ............................................................................................................................................125

G.4 REQUIREMENTS ...........................................................................................................................................125

G.4.1 General ....................................................................................................................................................125

G.4.2 Steady-state life and screening. ...............................................................................................................125

G.4.3 Qualification .............................................................................................................................................125

G.4.3.1 Wafer fabrication................................................................................................................................125

G.4.3.2 Facility ...............................................................................................................................................126

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