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MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

CONTENTS

PAGE

PARAGRAPH

TABLES

TABLE B-I. Letter symbol for diodes and rectifiers......................................................................................................40

TABLE B-II. Letter symbol for thyristors ......................................................................................................................46

TABLE E-I. Sample plans ...........................................................................................................................................94

TABLE E-II. RHA levels and requirements..................................................................................................................97

TABLE E-III. Testing guidelines for changes to a qualified product.............................................................................98

TABLE E-IV. Screening requirements.........................................................................................................................99

TABLE E-V. Group A inspection ...............................................................................................................................104

TABLE E-VIA. Group B inspections for JANS devices..............................................................................................107

TABLE E-VIB. Group B inspections for JAN, JANTX, and JANTXV devices ............................................................111

TABLE E-VIC. Group B inspections (small die flow only) for JAN, JANTX, and JANTXV devices............................113

TABLE E-VII. Group C periodic inspections (all quality levels) .................................................................................114

TABLE E-VIII. Group D inspection (RHA inspections) ..............................................................................................117

TABLE E-IX. Group E inspections (all quality levels) ................................................................................................119

TABLE E-X. Minimum data requirements for JANS devices .....................................................................................121

TABLE G-I. Steady-state life time and temperature ..................................................................................................129

TABLE G-II. Die element evaluation requirements....................................................................................................130

TABLE H-I. Coating thickness and composition requirements ..................................................................................136

FIGURES

FIGURE A-1. Pulse measurements. ...........................................................................................................................18

FIGURE A-2. Example of expanded metallization.......................................................................................................20

FIGURE E-1. Order of procedure diagram for JAN, JANTX, and JANTXV device types ............................................90

FIGURE E-2. Alternate order of procedure diagram for JAN, JANTX, and JANTXV device types..............................91

FIGURE E-3. Order of procedure diagram for JANS...................................................................................................92

FIGURE E-4. JANS PIND flowchart ............................................................................................................................93

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