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MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

CONTENTS

PAGE

PARAGRAPH

1. SCOPE .....................................................................................................................................................................1

1.1 Scope ..................................................................................................................................................................1

1.2 Description...........................................................................................................................................................1

1.3 Identification ........................................................................................................................................................1

1.3.1 Quality level for encapsulated devices ..........................................................................................................1

1.3.2 Quality level for unencapsulated devices. .....................................................................................................1

1.3.3 Manufacturers and critical interface identifiers ..............................................................................................2

1.3.4 RHA designator.............................................................................................................................................2

1.3.5 Component designation ................................................................................................................................2

1.3.6 Identification number.....................................................................................................................................2

1.3.7 Suffix letters ..................................................................................................................................................2

1.3.8 Device substitutions. .....................................................................................................................................2

2. APPLICABLE DOCUMENTS ....................................................................................................................................3

2.1 General................................................................................................................................................................3

2.2 Government documents ......................................................................................................................................3

2.2.1 Specifications, standards, and handbooks....................................................................................................3

2.3 Non-Government publications. ............................................................................................................................3

2.4 Order of precedence............................................................................................................................................3

3. REQUIREMENTS .....................................................................................................................................................4

3.1 Specification sheets.............................................................................................................................................4

3.1.1 Implementation date......................................................................................................................................4

3.2 Qualification.........................................................................................................................................................4

3.2.1 Certification options.......................................................................................................................................4

3.3 Performance requirements for JAN, JANTX, JANTXV, and JANS devices, and JANHC and JANKC die ...........4

3.4 Reference to specification sheets........................................................................................................................4

3.5 Certification..........................................................................................................................................................5

3.5.1 Transitional certification to appendix C .........................................................................................................5

3.5.2 DMS approval ...............................................................................................................................................5

3.5.3 DMS listing....................................................................................................................................................6

3.5.4 MIL-STD-750 laboratory suitability. ...............................................................................................................6

3.6 Traceability. .........................................................................................................................................................6

3.7 Certification of conformance and acquisition traceability. ....................................................................................6

3.8 Critical interface and materials ............................................................................................................................7

3.9 Lead and terminal finish.......................................................................................................................................7

3.10 Marking..............................................................................................................................................................7

3.10.1 Marking on each device ..............................................................................................................................7

3.10.2 Marking on initial container (unit package)..................................................................................................8

3.10.3 Special marking ..........................................................................................................................................8

3.10.3.1 ESDS identifier .....................................................................................................................................8

3.10.3.2 Beryllium oxide package identifier ........................................................................................................8

3.10.4 Marking legibility .........................................................................................................................................8

3.10.5 Polarity marking of unidirectional diodes and thyristors. .............................................................................8

3.10.5.1 Diodes. .................................................................................................................................................8

3.10.5.2 Thyristors..............................................................................................................................................8

3.10.6 PIN ..............................................................................................................................................................8

3.10.6.1 JAN and J marking ...............................................................................................................................9

3.10.6.1.1 JAN branded prefix ........................................................................................................................9

3.10.7 Manufacturer's designating symbol.............................................................................................................9

3.10.8 Lot identification code .................................................................................................................................9

3.10.8.1 Lot identification code suffix letter.........................................................................................................9

3.10.8.2 Code for plants .....................................................................................................................................9

3.10.9 Serialization ................................................................................................................................................9

3.10.10 DMS marking ..........................................................................................................................................10

3.10.11 Country of origin......................................................................................................................................10

3.10.12 Manufacturer's name, abbreviation, or trademark...................................................................................10

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