MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX E

E.5 SCREENING

E.5.1 Screening. All JANS, JANTXV, and JANTX semiconductor devices (100-percent) shall have been subjected

to, and passed, all the applicable screening tests (as specified in table E-IV) in the sequence shown and the

applicable percent defective allowed (PDA) for the type of semiconductor and quality level (device class) specified.

Devices which fail any test criteria in the screening flow shall be identified and controlled until removal from the lot. At

the option of the manufacturer, the rejects may continue processing to allow the manufacturer to maintain traceability.

The lot records shall identify the point of failure and the actual percent defective (PD) (as applicable). Any rejected

devices shall be removed from the lot prior to shipment. Manufacturers shall have a procedure to address screening

failures. Screening failures should be evaluated as necessary to determine root cause of failure to provide a means

for continuous improvement. Except for JANS, the conditioning and screening tests performed as standard

production tests need not be repeated when these are predesignated and acceptable to the qualifying activity as

being equal to or more severe than specified herein provided the relative process conditioning sequence is

maintained. All tests, preconditioning and screening operations, which were performed on the devices submitted for

qualification inspections specified herein shall be performed on all devices subsequently submitted for conformance

inspection (see E.6).

E.5.2 Percent defective allowable (PDA). Selected electrical parameters shall be designated in the specification

sheet for screen 11 and 13, of table E-IV which shall be used for the PDA calculation. These parameters may also

be compared to determine whether the change during burn-in (delta) is indicative of a lot stability problem. All burn-in

pre-conditioning failures, either high temperature reverse bias (HTRB) or power burn-in, shall be counted towards the

applicable PD unless the pre-conditioning is part of the manufacturer's qualified flow. A lot which fails PDA shall be

subjected to an engineering evaluation.

E.5.2.1 JANTX and JANTXV PDA. The PDA for each inspection lot (or screening lot if the alternate flow is used)

shall be 10 percent (for each burn-in) on all failures for the specified electrical parameters in screens 11 and 13a of

table E-IV. Delta limits shall be defined in the specification sheets. For delta limits, the delta parameter values

measured after burn-in (100-percent screening test) shall be compared with delta parameter values measured prior to

that burn-in. Unless otherwise specified, inspection lots which exceed the 10 percent PDA may be resubmitted one

time only to the burn-in operation failed. The PDA shall be 3 percent on the resubmitted inspection lot to each failed

burn-in. If the combined burn-in PD's for the first submission exceeds 20 percent, or either of the resubmitted burn-in

exceed the 3 percent PDA, the entire lot shall be unacceptable for any quality level.

E.5.2.2 JANS PDA. The PDA for each inspection lot shall be 5 percent (for each burn-in) on all failures for

specified electrical parameters in screens 11 and 13a of table E-IV. Delta limits shall be defined in the specification

sheets. For PDA delta limits, the delta parameter values measured after burn-in (100-percent screening test) shall be

compared with delta parameter values measured prior to that burn-in. Unless otherwise specified, inspection lots

which exceed the 5 percent PDA may be resubmitted one time only to the burn-in operation failed. The PDA shall be

3 percent on the resubmitted inspection lot to each failed burn-in. If the combined burn-in PD for the first submission

exceeds 10 percent, or either of the resubmitted burn-in exceed the 3 percent PDA, the entire inspection lot shall be

unacceptable for any quality level. A lot which fails the PDA shall be subjected to an engineering evaluation.

E.5.3 JANTX and JANTXV product. The procedure for testing and screening for JANTXV and JANTX devices

shall be in accordance with tables E-IV, E-V, E-VIB, E-VII, figure E-1, and as specified in the applicable specification

sheet.