MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX E

E.5.3.1 Alternate procedure for screening of JANTX and JANTXV types. JAN types may be processed and

marked as JANTX and JANTXV types by the original part manufacturer on their own qualified product provided the

following procedures are satisfied:

All devices to be proposed for JANTXV processing (except clear glass JANTXV diodes which shall be

subjected to internal visual inspection before painting or marking) shall have been subjected to and passed

JANTXV internal visual 100-percent screening prior to seal.

Groups A, B, and C inspection shall have met the JANTX and JANTXV level requirements in accordance

with tables E-V, E-VIB, E-VII, figure E-2 , and the applicable specification sheet.

Screening shall be conducted in accordance with table IV, figure E-2, and the applicable specification sheet.

All units failing these tests shall be removed from the lot and the quantity removed shall be noted in the lot

history.

A sample of the screened devices shall be submitted to and pass the requirements of table E-V, subgroups

1 and 2 inspection (see table E-V and table E-VIA, subgroup 1) (see table E-VIB, subgroup 1) subsequent to

the 100-percent screening (of the lot or separate portions thereof) as specified in E.5.3.1.c and as shown on

figure E-2.

E.5.3.2 Bin and cell pre and post burn-in electrical measurements. Alternate methods to variables recording may

be used to determine delta end-point requirements of JANTX and JANTXV burn-in provided the qualifying activity has

granted written approval. When alternate methods to variables recording are used to determine delta end-point

requirements, devices shall be separated into groups, each of which shall have maximum and minimum limits on the

variable parameter(s). The difference in parameter limits for any group shall not exceed the delta requirements for

the variable parameter(s).

E.5.3.3 Alternate procedures for qualification and conformance inspection where JAN is not covered by the

specification sheet. When the JAN quality level is not included in the specification sheet, or at the option of the

manufacturer, the alternate flow (see figure E-2) may be used for qualification and conformance inspection. The lot

used shall be marked in accordance with 3.10.1, except the "JAN" designating symbol shall be replaced by "JANQ".

Unless they are submitted to the flow that the lot was submitted to, these samples shall not be shipped.

E.5.3.4 Lead forming for JANTX and JANTXV. When lead forming is specified, it shall be followed by n = 116, c =

0 fine and gross seal tests, group A, subgroup 2, and external visual examination, n = 45, c = 0.

E.5.4 JANS product. The procedure for testing and screening of JANS devices shall be in accordance with tables

E-IV, E-V, E-VIA, E-VII, figure E-3, figure E-4, and the applicable specification sheet.

E.5.4.1 PIND test for JANS devices. The inspection lot (or sublots) shall be submitted to 100-percent PIND testing

a maximum of five times in accordance with test method 2052 of MIL-STD-750, test condition A. PIND prescreening

shall not be performed. The lot may be accepted on any of the five runs if the percentage of defective devices is less

than one percent (zero failures allowed for lots of less than 50 devices). All defective devices shall be removed after

each run. Lots, which do not meet the one percent PDA on the fifth run, or exceed 25 PD cumulative, shall be

rejected and resubmission is not allowed. These parts shall not be shipped as any other quality level. When

calculating numbers of allowed failures using percentages, fractional values shall be increased to the next whole

integer (see figure E-4).