MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX E

E.6.5 Group D inspection. Group D inspection shall be performed in accordance with table E-VIII and the

requirements of the specification sheet. Group D may be completed any time in the lot history (i.e., prior to lot

formation, or before screening ). Group D sample devices shall be assembled in it's qualified package or in any

qualified package that the manufacturer has data to correlate the performance to the designated package and as a

minimum, pass group A, subgroup 2 prior to irradiation. A sample which fails group D may be resubmitted once, in

accordance with E.3.6.3. In lieu of resubmission, a lot or wafer which fails group D testing may be used as a non-

RHA devices or may be certified at a lower RHA level if the group D data indicates the lot or wafer meets the lower

level requirements.

E.6.6 Group E inspection. Group E is a workmanship, ruggedness, and critical interface verification inspection.

Group E testing, when specified on the specification sheet is required for initial qualification, re-qualification, and

when group E requirements are changed. Whenever group E is re-performed due to changes in requirements

(including sample size and bias condition modifications), only the affected subgroups need to be performed except

ESD classification shall be performed (see E.4.2.1). The results of group E testing shall be submitted to the

qualifying activity (by all manufacturers prior to shipment of product, as applicable). Product redesigns may be

subjected to group E testing as required by the qualifying activity.

E.6.6.1 Group E testing requirements. Group E shall be performed in accordance with table E-IX and the

specification sheet. All tests within a subgroup shall be performed in the order specified. An evaluation shall be

performed on all failures to determine if the failure mode is the result of a latent (time dependent) defect,

workmanship, or design weakness. Appropriate corrective action shall be performed and approved by the qualifying

activity.

E.6.6.2 Alternate group E testing procedures. Manufacturers may use internal design verification or ongoing

reliability assessment programs in lieu of group E, subgroups 1 and 2 only, provided this testing is equivalent to or

more stressful than group E and is performed using the same design and construction on file at the qualifying activity.

This alternate testing shall be approved by the preparing activity and the qualifying activity.

E.6.7 Groups B, C, D, and E end-points. Post-test end-points specified in the specification sheet shall be

measured for each device of the sample after completion of all specified tests in the subgroups. Pre-test electrical

failures shall be replaced by acceptable devices. An engineering evaluation shall be performed and corrective action

taken if necessary on all screened devices, which fail pre-test. Resubmission of the lot to the failed parameter shall

be initiated whenever operator error or mishandling is not found to be the cause for failure. Except as specified or

otherwise required, all life test (such as operation, storage, blocking) end-point measurements shall be performed

within 96 hours after sample units have been subjected to and removed from required tests. All other end-point test

measurements shall be made within 168 hours, or as specified. Additional measurements may be made at the

discretion of the manufacturer. If end-point measurements can not be performed within the specified time, refer to

the applicable MIL-STD-750 test method for the procedure to follow.