MIL-PRF-19500P
APPENDIX E
TABLE E-IV. Screening requirements - Continued.
MIL-STD-750,
JANS
JANTXV
JANTX
Screen
Condition
method
requirements requirements
requirements
100-percent Not applicable Not applicable
1a. Die visual for glass
2073
Condition B, die form
diodes
prior to assembly
1b. Internal visual
100-percent 100-percent
Not applicable
(pre-cap) inspection
2074 1/
For diodes
2069
For power FETs
2070
For microwave
transistors
2072
For transistors
TSTG ≤ maximum rated Optional
2. High temperature life
1032
Optional
Optional
Nonoperating life
storage temperature
(stabilization bake)
t = as specified
20 cycles. No dwell time 100-percent 100-percent
3a. Temperature cycling
1051
100-percent
is required at +25°C.
Test condition C or
maximum storage
temperature, whichever
is less.
3b. Surge (as specified) 2/ 4066
Condition A or B, as
100-percent 100-percent
100-percent
specified
3c. Thermal impedance
As specified
100-percent 100-percent
100-percent
(as specified) 2/
Transistors,
Power FETs
3161
Bipolar
3131
Diodes
3101
IGBT
3103
GaAs FET
3104
Y1 direction at 20,000 G 100-percent Optional 3/
4. Constant acceleration.
2006
Optional 3/
Not required for stud
minimum, except at
devices and
10,000 G minimum
metallugically bonded
for devices with power
diodes.
rating of ≥10 watts at
TC = +25°C.
The 1 minute hold time
requirement shall not
apply.
5. PIND 4/
2052
Condition A
100-percent Not applicable Not applicable
See E.5.4.1
See footnotes at end of table.
99
For Parts Inquires call Parts Hangar, Inc (727) 493-0744
© Copyright 2015 Integrated Publishing, Inc.
A Service Disabled Veteran Owned Small Business