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MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P
APPENDIX E
TABLE E-V. Group A inspection.
JANS sample
JAN, JANTX,
Subgroups
MIL-STD-750,
plan 1/
JANTXV sample
method
plan 1/
Subgroup 1 (all devices except small die flow)
15 devices
116 devices, c = 0
c=0
(JANTXV)
Visual and mechanical inspection (test method 2071
2071
of MIL-STD-750)
45 devices, c = 0
(JAN, JANTX)
Subgroup 1 (for small die flow only 2/ 3/)
Visual and mechanical examination 4/
2071
116 devices, c = 0
(JANTXV)
45 devices, c = 0
(JAN, JANTX)
15 leads, c = 0
Solderability 4/
2026
Resistance to solvents 4/ 5/
15 devices, c = 0
1022
Temperature cycling (air to air) 4/
1051
Test condition C, or
maximum storage
temperature,
whichever is less,
25 cycles.
22 devices, c = 0
Electrical measurements (group A, subgroup 2)
Hermetic seal 6/
1071
22 devices, c = 0
Fine leak
Gross leak
Bond strength 4/
2037
Precondition
TA = +250°C at t =
24 hrs or
TA = +300°C at t = 2
hrs
11 wires, c = 0
Decap internal visual (design verification)
2075
4 devices, c = 0
See footnotes at end of table.
104



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