MIL-PRF-19500P
APPENDIX E
TABLE E-VII. Group C periodic inspections (all quality levels) .
MIL-STD-750
Inspections
Sample
Small lot
plan
conformance
inspection
Method
Condition
Subgroup 1
6 devices
15 devices
c=0
c=0
Physical dimensions 1/
2066
Dimensions in accordance with case
(not required for JANS )
outline specified in specification sheets.
Subgroup 2
22 devices
6 devices
c=0
c=0
Thermal shock
1056
25 cycles, condition B.
(liquid to liquid)
Temperature cycling
1051
Test condition C, or maximum storage
(air-to-air)
temperature, whichever is less. (45 cycles
including screening).
Terminal strength
2036
As specified.
Hermetic seal 2/
a. Fine leak
1071
Not required for double plug diodes.
b. Gross leak
Moisture resistance
1021
Omit initial conditioning.
Electrical measurements
Group A, subgroup 2.
Subgroup 3
22 devices
Not required for disc packages or
6 devices
c=0
metallurgically bonded double plug
c=0
devices or stud packaged devices.
Shock
2016
Nonoperating, 1,500 G's, 0.5 ms, 5 blows
in each orientation, X1, Y1, and Z1 (Y1
only for axial glass diodes.)
Vibration, variable
2056
frequency
Constant acceleration 3/
2006
1 minute minimum in each orientation.
X1, Y1, and Z1 at 20,000 G's minimum,
except at 10,000 G's minimum for devices
with power rating of ≥ 10 watts. TC =
+25°C.
Electrical measurements
Group A, subgroup 2.
See footnotes at end of table.
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