MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX G

G.4.3.2 Facility. JANHC qualification shall only be granted to a manufacturer who has a MIL-PRF-19500 certified

facility(basic plant). JANKC qualification will only be granted to a manufacturer who is MIL-PRF-19500 certified to

manufacture JANS products.

G.4.4 Performance characteristics. The electrical performance characteristics of semiconductor die shall be as

specified in the specification sheet.

G.4.5 Critical interfaces. The critical interfaces and physical dimensions of the semiconductor die shall be in

accordance with the requirements of MIL-PRF-19500 and with G.4.5.1 through G.4.5.3. A completed DLA Land and

Maritime Form 36D and die topography, including dimensions, pad locations, and metallization descriptions (die map)

shall be made available for inspection to the qualifying activity prior to qualification. A unique critical interface

identifier as part of the PIN shall be assigned based on any of the following differences:

Bond pad metal.

Backside metal.

G.4.5.1 Bonding pad. The bonding pad size, location, and electrical function shall be in accordance with the

applicable specification sheet. Unless approved by the qualifying activity, the minimum bond pad dimensions shall be

3 mils.

G.4.5.1.1 Metallization integrity. The bonding pads shall be metallized and suitable for bonding as specified in the

applicable specification sheet and shall meet the requirements of G.5.2.5.1.

G.4.5.2 Backing material. The backing material shall be as described in the specification sheet and meet the

requirements of G.5.2.5.2.

G.4.5.3 Glassivation. Glassivation requirements of H.3.7 apply.

G.5 VERIFICATION PROVISIONS

G.5.1 General. EE of semiconductor die shall be performed at a facility with MIL-STD-750 laboratory suitability for

the applicable test methods.

G.5.1.1 Responsibility for inspection. The supplier shall be responsible for the performance of all inspection

requirements as specified herein and in the specification sheet.

G.5.1.2 Retention of records. The supplier shall maintain adequate records of all examinations, inspections, and

tests performed in accordance with the requirements specified herein and the specification sheet. Records, including

variables data, shall be retained in accordance with appendix D.

G.5.1.3 JANKC wafer lot inspection. For JANKC, the process monitors of D.3.9.4 shall apply.

G.5.1.4 Sequence of testing. Subgroups within a group of tests (see table G-II) may be performed in any

sequence, but individual tests within a subgroup shall be performed in the sequence indicated.

G.5.1.5 Sample selection. Samples shall be randomly drawn from inspection lots. The sample size columns in

the evaluation tables give minimum quantities to be evaluated with applicable accept number enclosed in

parenthesis.

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