MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX G

G.5.1.6 Wafer traceability. For JANKC, wafer traceability shall be maintained on the inspection lot and the

element evaluation.

G.5.2 Element evaluation. Die from each wafer lot shall be evaluated in accordance with table G-II.

G.5.2.1 Subgroup 1, 100-percent electrical test of die. Each die shall be electrically tested, which may be done at

the wafer level provided all failures are identified and removed from the lot when the die are separated from the

wafer. Test limits and conditions shall be chosen by the supplier to assure compliance with all the electrical

characteristics specified by the specification sheet. This allows the supplier to assign test values or test details which

differ from the specification sheet requirements.

G.5.2.2 Subgroup 2, 100-percent visual inspection of die. Each die shall be visually inspected to assure

conformance with the die related requirements, test methods 2069, 2070, 2072, or 2073 of MIL-STD-750 as

applicable. Qualified die may be stored at the manufacture's facility prior to 100-percent visual.

G.5.2.3 Subgroup 3.

G.5.2.3.1 Internal/die visual inspection. The die visual sample shall be randomly selected from die that have

successfully completed subgroup 2 of table G-II.

G.5.2.3.2 Test sample preparation. Test samples shall be assembled in suitable packages using standard

assembly procedures.

G.5.2.3.3 Packaged sample identification. The packaged sample shall be marked or labeled in such a manner to

identify the following:

a. Serial numbers if required.

b. Device PIN.

c. Inspection lot number or date code.

G.5.2.3.4 Internal visual. Each sample may be visually inspected after assembly and prior to encapsulation to

assure conformance with the applicable requirements, test methods 2069, 2070, 2072, or 2073 of MIL-STD-750.

G.5.2.4 Subgroup 4.

G.5.2.4.1 Subgroup 4. Each sample shall be processed in accordance with subgroup 4 of table G-II.

G.5.2.4.2 Class HC sample size. The JANHC sample will consist of at least twenty two die from each inspection

lot.

G.5.2.4.3 Class KC sample size. The JANKC sample shall require three die from each wafer and a minimum of

fourty five die from each inspection lot.

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