MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16

MIL-PRF-19500P

APPENDIX G

G.5.2.5 Subgroups 5A and 5B.

G.5.2.5.1 Bond pull (5A). From each wafer lot, a sample of at least five die requiring twenty two bond wires

minimum shall be selected.

G.5.2.5.1.1 Wire bond strength testing. Bond strength shall be performed in accordance with test method 2037 of

MIL-STD-750, test condition D.

The die metallization shall be acceptable if no failure occurs. If only one wire bond fails, another sample may be

selected in accordance with G.5.2.5.1 and subjected to subgroup 5A evaluation. If the second sample contains no

failures, the bonding test results are acceptable and the lot of die is acceptable. If the second sample contains one or

more failures, or if more than one failure occurs in the first sample, the lot of die shall be rejected.

G.5.2.5.2 Die shear (5B). Die shear shall be performed in accordance with test method 2017 of MIL-STD-750. If

only one die fails, another sample may be selected and subjected to subgroup 5B evaluation. If the second sample

contains no failures, the die shear test results are acceptable and the lot of dice is acceptable. If the second sample

contains one or more failures, or if more than one failure occurs in the first sample, the lot of dice shall be rejected.

G.5.2.6 Subgroup 6, scanning electron microscope (SEM). To be performed on selected die designs in

accordance with E.3.1.2.2. Sample selection and reject criteria shall be in accordance with, test method 2077 of

MIL-STD-750.

G.5.2.7 Subgroup 7, radiation hardness assurance (RHA). RHA inspection shall be as specified in the

specification sheet.

G.5.3 Sample acceptance. The lot is acceptable if it passes all the appropriate requirements of table G-II. If the

test sample fails the criteria of the appropriate flow, the inspection lot shall be rejected. For JANKC lots represented

by five wafers or more, any wafer whose assembled sample fails any of the requirements of subgroup 4, table G-II

may be removed from the lot with no jeopardy to the rest of the lot if failure analysis determines that the failure

mechanism is inherent to the removed wafers only. The inspection lot is rejected if more than 20 percent of the

wafers had failures in subgroup 4 of table G-II If a failure is attributed to packaging or handling defects, Electrostatic

discharge (ESD), equipment malfunction, or operator error, these samples shall be verified by failure analysis. Upon

verification of such defects, the test sample may be replaced in accordance with appendix E.

G.5.3.1 Lots shipped prior to element evaluation completion. No lots shall be shipped prior to completion of the

element evaluation without the approval of the qualifying activity. This provision is only to be requested for

emergency procurement situations and it is expected that the user will provide a justification.

G.5.4 Storage. Die shall be stored in dry nitrogen or other inert atmosphere.

128