MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX G

G.6 PACKAGING

G.6.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the

contract or order (see 6.2). When actual packaging of materiel is to be performed by DoD or in-house contractor

personnel, these personnel need to contact the responsible packaging activity to ascertain packaging requirements.

Packaging requirements are maintained by the Inventory Control Point's packaging activities within the Military

Service or Defense Agency, or within the Military Service's system commands. Packaging data retrieval is available

from the managing Military Department's or Defense Agency's automated packaging files, CD-ROM products, or by

contacting the responsible packaging activity.

G.6.1.1 Packaging sensitivity. All semiconductor die shall be packaged in individually lidded containers. For ESD

sensitive devices (classes 1 and 2), conductive or anti-static containers shall be required with an external conductive

field shielding barrier. Stacking of containers without lids shall not be allowed. The supplier may submit an alternate

procedure for packaging of die for approval by the using activity.

G.6.2 Container marking. The following information shall be marked on each container of semiconductor die:

a. Type designation.

b. Applicable specification sheet number.

c. Manufacturer's logo or designation symbol.

d. Lot identification code.

e. Quantity.

f. ESD symbol ( if applicable).

g. Date code (see G.3.1).

h. Wafer identity for JANKC.

G.6.3 Certificate of conformance. The certificate of conformance shall be in accordance with 3.7

TABLE G-I. Steady-state life time and temperature.

Option

Minimum time

Minimum junction

temperature 1/

175�C

240 hours

150�C

500 hours

125�C

1,000 hours

1/ Example: If TJ of steady-state life test is 187.5�C �12.5�C, then option A is used.

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