MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

Pages 1 - 2 - 3 - 4 - 5 - 6 - 7 - 8 - 9 - 10 - 11 - 12 - 13 - 14 - 15 - 16

MIL-PRF-19500P

APPENDIX H

H.3.8 Critical interface restrictions. Unless it is part of the original design, the external surface of package, header,

or flange shall be finished and not have any depression or cavity. External parts, elements, or coatings shall not

blister, crack, (excluding glass meniscus), outgas, soften, flow, or exhibit defects that adversely affect storage,

operation, or environmental capabilities of semiconductor devices. For JAN, JANTX, and JANTXV the use of silicone

or organic material inside the packages shall only be allowed when approved by the qualifying activity. Desiccants

shall not be used. For JANS devices, silicone or organic materials may only be used when specified by the

specification sheet. Polymer impregnations (such as backfill) of the packages shall not be permitted.

WARNING: Packages containing beryllium oxide (BeO) shall be marked in accordance with 3.10.3.2 and shall

not be ground, machined, sandblasted, or subjected to any mechanical operation which will produce dust

containing any beryllium compound. Packages containing any beryllium compound shall not be subjected to

any chemical process (such as etching) which will produce fumes containing beryllium or it's compounds.

H.3.9 Metallurgical bond for JANS axial diodes. All JANS diodes (excluding Schottky barrier and point contact

ultra high frequency (UHF) devices) shall be metallurgically bonded at the interface of any mechanical connection

within the assembly of the device (see appendix A for axial lead diodes).

H.4 PACKAGE FINISH

H.4.1 Package finish. External metallic package elements, including leads and terminals, shall meet the applicable

environmental requirements without additional finishing, or shall be finished with a coating which conforms to one of

the options listed in H.4.3 and table H-I. Pure tin may not be used to coat any surface nor shall it be used as an

undercoat (see H 4.3.f).

H.4.2 Lead and terminal finish. In addition to the requirements of H 4.1, all leads and terminals, except those

intended to be attached using threaded fasteners, shall be solderable in accordance with test method 2026 of

MIL-STD-750. Combinations of pre-plate electroplate and/or electroless nickel shall not exceed 650 microinches

total.

H.4.3 Detail lead finish requirements.

For all devices mounted by leads or terminals coated by hot solder dipping, the coating shall extend to the

seating plane. For devices which are to be connected by wires soldered to lugs or other terminals not used

to mount the device, the solder shall cover an area extending .050 inches (1.27 mm) in all directions

beyond the designed attachment area.

b. For leads with solder applied over a surface which is not compliant with table H-I, all non-compliant material

shall be covered by solder to the package seal or point of lead emergence, or the lot shall pass test method

1041 of MIL-STD-750 salt atmosphere test with sample size of to 22 pieces, no failures allowed.

All devices which are solder dipped shall pass screen 14 of table E-IV and table E-V, subgroup 2, appendix

E with a sample size of 116 pieces, no failures allowed.

All copper or copper clad leads that are to be plated with gold or silver shall first be coated with a barrier

layer to prevent diffusion of the copper through the final lead finish.

Silver leads and silver cladding shall contain a minimum of 99.7 percent pure silver.

Tin based coatings shall be alloyed with a minimum of 3 percent lead which has been shown to inhibit the

growth of tin whiskers. Pure tin shall not be used as an undercoat.

135