MIL-PRF-19500P
APPENDIX H
TABLE H-I. Coating thickness and composition requirements.
Thickness
Coating
microinch/micrometer
Coating composition requirements
Minimum
Maximum 1/
Hot solder dip (for round
60/1.52
NS
The solder bath shall have a nominal composition
leads) 2/
of Sn60 or Sn63. 3/
Hot solder dip (for all shapes
200/5.08
NS
The solder bath shall have a nominal composition
other than round leads) 2/ 4/
of Sn60 or Sn63. 3/ 5/
Tin plate (as plated) 6/
300/7.62
NS
Shall contain no more than 0.12 percent by weight
co-deposited organic material measured as
elemental carbon. See H.4.3. f.
Tin-lead plate (as plated)
200/5.08
NS
Shall consist of 3 to 50 percent by weight lead
4/ 6/
(balance nominally tin) homogeneously co-
deposited. Shall contain no more than 0.12
percent by weight co-deposited organic material
measured as elemental carbon.
Tin dipping 4/
100/2.54
See H.4.3.f.
Gold plate
10/.254
225/5.72
Shall contain a minimum of 99.7 percent gold.
Only cobalt shall be used as the hardener.
Silver plate
100/2.54
425/10.8
99.7 percent silver minimum.
Silver cladding
250
Nickel plate (electroplate)
50/1.27
350/8.89
The introduction of organic addition agents to
7/ 8/
nickel bath is prohibited. Up to 40 percent by
weight cobalt is permitted as a co-deposit.
Nickel plate (electroless)
50/1.27
250/6.35
The introduction of organic addition agents to
7/ 8/
nickel bath is prohibited.
Nickel cladding 9/
50/1.27
350/8.89
1/
NS = not specified.
2/
See H.4.3.a and H.4.3.b.
The solder Sn concentration in the pot may range from 50 percent Sn to 70 percent Sn.
3
4/
For threaded stud packages and for terminals not intended for mounting the device only, the minimum coating
thickness shall be 100 microinches/2.54 micrometers.
5/
As measured to the center of the flat.
6/
The maximum carbon content (and minimum lead content in tin-lead plate) shall be determined by the
manufacturer on at least a quarterly basis. The determination of carbon and lead content may be made by any
accepted analytical technique (e.g., for carbon: Pyrolysis, infrared detection (using an IR212, IR244 infrared
detector or equivalent); for lead: X-ray fluorescence, as long as the assay reflects the actual content in the total
deposited finish.
7/
The maximum specified thickness applies to the final coating, provided all previously deposited
nickel layers have been annealed to eliminate the residual deposition stress.
8/
Combinations of pre-plate electroplate or electroless nickel and final electroplate nickel finishing shall
not exceed 700 microinches/17.78 micrometers total. Combinations of pre-plate electroplate nickel
and final electroless nickel plate finishing shall not exceed 600 microinches total.
9/
Maximum nickel thickness applies only to lead material.
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