MIL-PRF-19500P
This specification is approved for use by all Departments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification establishes the general performance requirements for semiconductor devices.
Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk.
Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage
program of semiconductor devices the military and space community can rely on to be dependable and available.
Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and
specification sheets are structured to assure the interchangeability of devices of the same part type regardless of
manufacturing date code or conformance inspection (CI) completion date. Four quality levels for encapsulated
devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight
radiation hardness assurance (RHA) levels are provided for the JANTXV and JANS quality levels. These are
designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels
for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.
1.2 Description. This specification contains the performance requirement and verification methods for
semiconductor devices. The main body specifies the performance requirements and requires the manufacturer to
verify that their devices are capable of meeting those performance requirements. Appendix A contains definitions of
terms used throughout the specification. Appendix B contains abbreviations and symbols. Appendix C contains the
Quality Management (QM) Program. Appendix D contains the quality system. Appendix E contains the standard
verification system for qualified products. Appendix F has been cancelled. Appendix G contains discrete
semiconductor die/ship lot acceptance. Appendix H contains critical interface and materials for semiconductor
devices.
1.3 Identification. The part numbering schemes are as follows:
The Part or Identifying Number (PIN) for encapsulated semiconductor devices furnished under this
a.
specification is formulated as follows:
JANQQQ
A
XN
YYYY
ZZZ
JAN brand and
RHA designator
Component
Identification
Suffix
quality level
(see 1.3.4)
designation
number
letters
(see 1.3.1)
(see 1.3.5)
(see 1.3.6)
(see 1.3.7)
b.
The PIN for unencapsulated semiconductor devices furnished under this specification is formulated as
follows:
JANQCW
A
XN
YYYY
ZZ
JAN brand quality level
RHA designator
Component
Identification
Suffix
and identifiers
(see 1.3.4)
designation
number
letters
(see 1.3.2 and 1.3.3)
(see 1.3.5)
(see 1.3.6)
(see 1.3.7)
1.3.1 Quality level for encapsulated devices. The quality levels for encapsulated devices includes the JAN brand
and associated modifiers as applicable (denoted by "QQQ" in 1.3.a). These quality levels from the lowest level to the
highest level are JAN, JANTX, JANTXV, and JANS in accordance with appendix E. JANS is intended for space
applications. In specification sheets where the JAN level has been removed or omitted, it is acceptable via this
document to manufacture and qualify the JAN assurance level once the qualifying activity has been notified and
qualification has been extended to the JAN level. In these cases, the manufacturer will also notify the preparing
activity to include the JAN level in the next revision of the applicable specification sheet.
1.3.2 Quality level for unencapsulated devices. The quality levels for unencapsulated devices includes the JAN
brand and associated modifiers as applicable (denoted by "QC" in 1.3.b). JANKC is intended for space applications
and JANHC is intended for standard military applications.
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