MIL-PRF-19500P
1.3.3 Manufacturers and critical interface identifiers. "W" is the place holder for the applicable letter which identifies
the manufacturer and the critical interface of a semiconductor die (see 1.3.b).
1.3.4 RHA designator. The RHA designator is a letter which identifies the applicable RHA level (denoted by "A" in
1.3). The RHA levels from lowest to highest are M, D, P, L, R, F, G, and H. (See appendix E, table E-II.)
1.3.5 Component designation. Semiconductor devices are identified by the prefix "XN". The "X" will usually be a
number that is one less than the number of active element terminations (see 1.3).
1.3.6 Identification number. It is recommended that each type of semiconductor device intended for
standardization be assigned an identification, serially, by the, JEDEC Solid State Technology Association, a council
sponsored by the Electronic Industries Alliance (EIA) 2500 Wilson Boulevard, Arlington, VA 22201-3834,
www.jedec.org. The assignment will provide the component designation and the identification number.
1.3.7 Suffix letters. The following suffix letters may be incorporated in the military part number as applicable.
A, B, C, etc. (except L, M, R, S, U, P)
Indicates a modified version which is substitutable for the basic
numbered (non-suffix) device.
M
Indicates matching of specified parameters of separate devices.
R
Indicates reverse polarity packaging of the basic numbered device.
L or S
Indicates that the terminal leads are longer or shorter, respectively,
than those of the basic numbered device.
P
Indicates particle impact noise detection (PIND) screened devices
(JANTX, and JANTXV only).
U
Indicates unleaded or surface mounted devices (different package
configurations may also include a suffix letter).
UR
Indicates unleaded or surface mounted (round end-cap diodes).
US
Indicates unleaded or surface mounted (square end-cap diodes).
-1
Indicates metallurgical bond.
Suffix letter(s), except for P, must be used and marked on the device only when specific device types are covered by
the applicable specification sheet requiring the suffix letters (see 3.10.6).
1.3.8 Device substitutions. A device of a higher product assurance level may be substituted for the same basic
PIN device of a lower product assurance level. Product assurance levels, in descending order of assurance are:
JANS, JANTXV, JANTX, and JAN (for chips, JANKC may replace JANHC). RHA devices tested to a higher total
dose requirement may be substituted for the same basic PIN device with a lower total dose requirement (see
appendix E, table E-II). For axial leaded diodes where the same PIN, both with and without a dash one (-1) suffix
exists, the dash one device is considered to be a higher assurance level and may be substituted for the non-dash one
part. Non-dash one devices are inactive for new design (whenever dash-one devices exist). For those devices
selected to voltage tolerance (e.g., zener diodes, transient voltage suppressors) the tighter tolerance device may be
substituted for one of the more relaxed tolerance devices. For those devices selected to temperature coefficient
(e.g., voltage reference diodes) the tighter tolerance device may be substituted for one of the more relaxed tolerance
devices. Those devices (including unencapsulated devices) having higher voltage ratings may be substituted for
lower voltage ratings, provided all other parameters are equal (e.g., 600 PIV for 100 PIV diode). Devices having
suffix letters L or S or no lead length designator, may be substituted for each other in applications where the alternate
lead length will fit. JANTX 'P' devices are substitutable for JANTX devices and JANTXV `P' devices are substitutable
for JANTXV devices. The part being used for substitution may retain its original marking, or the PIN may be
remarked. Lot records must maintain traceability of any remarking.
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