MIL-PRF-19500P
3.10.10 DMS marking. The DMS mark is not part of the part number, will not be included in the PIN, and shall be
distinctly separate from all other marking. DMS may be abbreviated as "D".
3.10.11 Country of origin. The manufacturer shall indicate the country of origin of the device if other than USA. At
the option of the manufacturer the country of origin marking may be omitted from the body of the device but shall be
retained on the initial container.
3.10.12 Manufacturer's name, abbreviation, or trademark. At the manufacturer's option, devices supplied to this
specification may be marked with the device manufacturer's name, abbreviation, or trademark in place of the
designating symbol described in 3.10.7, except for a manufacturer with multiple facility locations. The name or
trademark of only the original manufacturer shall appear on the device or initial container. Alteration of name or
trademark shall not be permitted.
3.10.13 Marking option. Except for serialization, the manufacturer has the option of marking the entire lot or only
the sample devices prior to CI. If the manufacturer exercises the option to mark only the sample devices, the
procedure shall be as follows:
a.
The sample devices shall be marked prior to performance of conformance or qualification inspection.
b.
At the completion of inspection, the marking of the sample devices shall be inspected for conformance with
the requirements of 3.10.1 and 3.10.4.
c.
The inspection lot represented by a conforming inspection sample shall then be marked and any specified
visual and mechanical inspection performed.
d.
The marking materials and processing applied to the inspection lot shall be to the same specification as
those used for the inspection sample.
3.11 Solderability. All parts shall be capable of passing the solderability test in accordance with method 2026 of
MIL-STD-750 on delivery. Re-inspection of solderability is not required by this specification. However, when
solderability re-inspection is performed (either at the option of the manufacturer, supplier, or by customer contract),
the re-inspection date shall appear on all subsequent certificates of conformance and traceability (see 3.7).
3.12 ESD control. Semiconductors classified as class 0, 1A, 1B, 1C, 2, 3A, or 3B (see E.4.2.1) shall be handled in
accordance with JESD-625, or other industry standard practice, to safeguard against discharge damage, as
applicable. A minimum humidity level of 30 percent shall be maintained unless approved by the qualifying activity.
Work stoppage shall occur when relative humidity drops below the approved minimum. An effective corrective and
preventative action(s) shall be implemented prior to work resumption.
3.13 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally
preferable materials should be used to the maximum extent possible provided that the material meets or exceeds the
operational and maintenance requirements, and promotes economically advantageous life cycle costs.
3.14 Pure tin. The use of pure tin, as an underplate or final finish, is prohibited both internally and externally. Tin
content of components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3
percent lead, by mass (see 6.8)
3.15 Workmanship. Semiconductor devices shall be processed in such a manner as to be uniform in quality and
shall be free from other defects that will affect life, serviceability, or appearance.
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