MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

6.4 Supersession information. Devices covered by specification sheets are substitutable for the manufacturer's

and user's PIN's. This information in no way implies that manufacturer's PINs are suitable as a substitute for the

military PIN. The table below is an example of the type of cross reference data that should be available in the

specification sheets.

Supersession and cross reference data.

Military

Manufacturer's

Manufacturer's and user's

CAGE code

6.4.1 Methods of qualification. There are two methods to supply JAN semiconductors to MIL-PRF-19500.

Appendix D and appendix E defines the historical screening, sampling, and quality system approach formerly listed

on the QPL. Appendix C defines the QML approach. It includes the following important features:

Technical Review Board (TRB).

Optimization.

Quality planning.

Statistical techniques.

On-going reliability program (fit rate prediction).

QM plan.

Product characterization and capability evaluation.

Failure mode and effects analysis (FMEA).

One method is not preferred over the other. When large volume device production is typical, the qualified

manufacturer approach, which focuses on qualifying the process and production line (see appendix C), offers

significant advantages to the supplier. Small companies with modest volumes often find the historical qualified

products approach more cost effective. Suppliers should choose their method based on their business environment.

Leveraging off high volume commercial lines has proven to be effective in the Microcircuit QML. However, the

majority of MIL-PRF-19500 suppliers do not have similar high volume commercial production to leverage from.

6.4.2 QML format. QML-19500 will be divided into two sections. The first section will include all device listings

qualified by the manufacturer. This section lists part number, electrostatic discharge (ESD) class, manufacturer's

designating symbol, qualification reference, specification sheets, qualified products approval status (appendix D

certification or DMS approval) status, and manufacturer's plants. The second section alphabetically lists

manufacturers with the following information as a minimum:

Manufacturers' name, manufacturers' management representative, address, fax, e-mail, and phone number.

Location of wafer fabrication, assembly, and test operations.

Contracted operations (if applicable).

Commercial and Government Entity (CAGE) code and manufacturing designating symbol and logo.

Qualified products approval status (appendix D certification, or DMS approval).