MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

6.5 Subject term (key word) listing:

Conformance inspection

Radiation hardness assurance

Double plug construction

Statistical process control

Electrostatic discharge sensitivity

Technical review board

Failure analysis

Test optimization

Metallurgical bond

Thermal match

Qualification

Thermal response

Qualified Manufacturers Listing

6.6 PIN. This specification requires a PIN that describes codification and/or classification and appropriate

references to associated documents (see 1.3 and 3.1 herein).

6.7 Environmentally preferable material. Environmentally preferable materials should be used to the maximum

extent possible to meet the requirements of this specification. As of the dating of this document, the U.S.

Environmental Protection Agency (EPA) is focusing efforts on reducing 31 priority chemicals. The list of chemicals

and additional information is available on their website at https://www.epa.gov/osw/hazard/wastemin/priority.htm.

Included in the EPA list of 31 priority chemicals are cadmium, lead, and mercury. Use of these materials should be

minimized or eliminated unless needed to meet the requirements specified herein (see section 3).

6.8 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin

whisker growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture

and can develop under typical operating conditions, on products that use such materials. Conformal coatings applied

over top of a whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass,

have shown to inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545

(Standard Specification for Electrodeposited Coatings of Tin).

6.9 Changes from previous issue. Marginal notations are not used in this revision to identify changes with respect

to the previous issue due to the extensiveness of the changes.