MIL-PRF-19500P
APPENDIX A
DEFINITIONS
A.1 SCOPE
A.1.1 Scope. This appendix contains the definitions of terms used with semiconductor devices. This appendix is
not a mandatory part of the specification. The information contained herein is intended for guidance only.
A.2 APPLICABLE DOCUMENTS. This section not applicable to this appendix.
A.3 SEMICONDUCTOR COMMON DEFINITIONS
A.3.1 Absolute maximum ratings. The values specified for "ratings", "maximum ratings", or "absolute maximum
ratings" are based on the "absolute system" and unless otherwise required for a specific test method, are not to be
exceeded under any service or test conditions. These ratings are limiting values beyond which the serviceability of
any individual semiconductor device may be impaired. Unless otherwise specified, the voltage, current, and power
ratings are based on continuous dc power conditions at free air ambient temperature of +25°C. For pulsed or other
conditions, or operation of similar nature; the current, voltage, and power dissipation ratings are a function of time and
duty cycle. In order not to exceed absolute ratings, the equipment designer has the responsibility of determining an
average design value, for each rating, below the absolute value of that rating by a safety factor, so that the absolute
values will never be exceeded under any usual conditions of supply-voltage variation, load variation, or manufacturing
variation in the equipment itself.
A.3.2 Ambient temperature. Ambient temperature is the air temperature measured below a semiconductor device,
in an environment of substantially uniform temperature, cooled only by natural air convection, and not materially
affected by reflective and radiant surfaces.
A.3.3 Anode. The electrode from which the forward current flows within the device.
A.3.4 Specification sheet. Since this specification covers the general requirements and tests for semiconductor
devices, the details of performance of the semiconductor device shall be specified in the specification sheet. Items
listed below should be covered in the specification sheet:
a.
PIN (see 1.3).
b.
Generic design, construction, and material (see appendix H).
c.
The marking to be omitted, if any (see 3.10). The order of precedence for marking is as listed in 3.10.1.
d.
Classification of inspection.
e.
Examination and tests to be performed under qualification inspection.
f.
Examination and tests to be performed under CI.
g.
Examination and tests to be performed under screening inspection.
h.
End-point measurements to be made for group A, B, C, D, and E inspections (see appendix E).
i.
Quality levels covered.
j.
Device level and screening procedure if other than table E-IV.
k.
Sequence of test, test method, test condition, limit, cycles, temperature, or axis; when not specified, or if
other than specified herein.
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