MIL-PRF-19500P
APPENDIX A
A.8.3.1 Steady-state dc high temperature reverse bias. High temperature reverse bias which applies steady-state
dc blocking voltage.
A.8.3.2 Half-wave high temperature reverse bias. High temperature reverse bias which applies half-wave blocking
voltage.
A.8.3.3 Full-wave high temperature blocking bias. High temperature reverse bias which applies full-wave blocking
voltage; sometimes applicable to symmetrical thyristors or transient voltage suppressors.
A.8.4 Operating life. A generic term describing a sample test which operates and internally heats a device junction
for an extended time to verify lot integrity. This is generally an extension of power burn-in.
A.8.4.1 Rectifying ac operating life. Operating life whereby heating is accomplished through the alternate
application of forward current and reverse voltage.
A.8.4.2 Steady-state dc operating life. Operating life whereby heating is accomplished through the application of
steady-state forward current, reverse current, or forward power for diodes (including rectifiers), zeners, and
transistors respectively.
A.8.4.3 Intermittent operating life. Operating life whereby junction temperature (TJ) and case temperature (TC) is
cycled through a specified temperature range by a heating current or power and a cooling period, when current or
power is removed.
A.8.4.3.1 Rectifying ac intermittent operating life. Intermittent operating life whereby the device is subjected to
forward current and reverse voltage, during the heating period.
A.8.4.3.2 DC intermittent operating life. Intermittent operating life whereby the device is subjected to steady-state
forward current or equivalent half sine forward current, during the heating period. This test is also known as power
cycling or thermal fatigue.
A.8.5 Blocking life. A generic term describing a sample test which applies a blocking voltage and is normally
performed at a specified high ambient or case temperature through the external application of heat.
A.8.5.1 Steady-state dc blocking life. Blocking life which applies steady-state dc blocking voltage.
A.8.5.2 Half-wave blocking life. Blocking life which applies half-wave blocking voltage.
A.8.5.3 Full-wave blocking life. Blocking life which applies full-wave blocking voltage.
A.8.6 Temperature cycling (air to air). Temperature cycling at device's case temperature through a specified range
by the external heating and cooling of the device in an air to air environment.
A.8.7 Thermal shock (liquid to liquid). Thermal shock cycling at device's case temperature through a specified
range by the external heating and cooling of the device in a liquid to liquid environment.
A.8.8 Thermal impedance. Thermal impedance for the purpose of this specification is the application of an
electrical stress sufficient to pass heat through the interface of dissimilar materials, primarily to determine the quality
of attachment by measuring the electrical characteristics of the temperature sensitive parameter. Thermal
impedance measurement is performed by quantifying changes to the heat sensitive parameter caused by current flow
and its induced heating. It is used to detect interface voids between die, attachment medium and the header or heat
sink.
A.8.9 Surge. Surge is the application of a high peak current ten times (minimum) the device average current
maximum rating applied for a short pulse width appropriate to determine processing defects (e.g., wire bond integrity,
micro cracks, and bond voids).
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