MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P

APPENDIX C

C.3.1.1 QM plan. The QM plan documents the QM program and consists of the following three major elements:

1) The quality manual, in accordance with the quality system specified in appendix D; 2) The TRB information (see

C.4.1); and 3) Product quality planning information (see C.5.1). Product quality planning is expected to be

comprised of individual groups of documents that are specific to the technology being offered. Each technology that

is offered will have its own product quality planning information. The QM plan, itself, may be an index of references

to other documents which include the information required. In addition to these three major elements, the QM plan

will include the following as a minimum.

C.3.1.1.1 Quality improvement plan. The quality improvement plan documents are the specific procedures to be

followed by the manufacturer to assure continuous improvement (defined by C.8.4) in quality and reliability of the

process and the product being produced.

C.3.1.2 Failure analysis. This establishes the procedures that a manufacturer self-imposes to test and analyze a

sufficient quantity of failed parts to determine each failure category from all stages of manufacturing and the field.

This should also identify corrective actions or specify the use of a corrective action plan based on the findings of the

failure analysis.

C.3.1.3 Statistical process control (SPC) plan. A specific plan defining the manufacturer's SPC program within the

manufacturing process to the requirements of EIA-557.

C.3.1.4 Certification and qualification plan. The certification and qualification plan will be defined (see C.6 and

C.8).

C.3.1.5 Conversion/review of customer requirements. A procedure for reviewing customer's requirements, as

expressed in specifications and orders to determine if the device will meet expectations. This includes determining if

certification and QML coverage does not exist, and it may include converting the customer's requirements into in-

house requirements. This procedure should be documented (in addition to D.3.3).

C.4 TECHNICAL REVIEW BOARD

C.4.1 TRB responsibilities. The manufacturer defines its' own TRB structure. The purpose of the TRB is to

assess the impact of proposed product/process changes for reliability and form, fit, and function. The TRB is

responsible for product quality planning, covered by the QM program for the introduction of new products and

maintains the QML lines. Written procedures which will govern the operation of the TRB shall be maintained and

updated as defined in the procedures.

C.4.1.1 Organizational structure. The manufacturer's TRB will ensure communication is established and

maintained among representatives from device design, technology development, wafer fabrication, assembly, test,

production, and quality assurance. The TRB is intended to be a cross-functional technical group. The manufacturer

will submit the name(s) and telephone numbers of their TRB contact person(s) to the qualifying activity. The

members of the TRB shall have the responsibility and authority to make decisions and the resources to implement

these decisions. Records of the TRB deliberations and decisions will be maintained and made available to the

qualifying activity.