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MIL-PRF-19500 Semiconductor Devices, General Specification ForThis specification establishes the general performance requirements for semiconductor devices. Product assurance is provided by effective screening, conformance inspection, and process controls to mitigate risk. Mission assurance and standardization of parts are the highest priorities. This specification establishes a heritage program of semiconductor devices the military and space community can rely on to be dependable and available. Detail requirements and characteristics are specified in the specification sheets. Revisions to this specification and specification sheets are structured to assure the interchangeability of devices of the same part type regardless of manufacturing date code or conformance inspection \(CI\) completion date. Four quality levels for encapsulated devices are provided for in this specification, differentiated by the prefixes JAN, JANTX, JANTXV, and JANS. Eight radiation hardness assurance \(RHA\) levels are provided for the JANTXV and JANS quality levels. These are designated by the letters M, D, P, L, R, F, G, and H following the quality level portion of the prefix. Two quality levels for unencapsulated devices are provided for in this specification, differentiated by the prefixes JANHC and JANKC.

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MIL-PRF-19500P
APPENDIX C
C.4.2 TRB duties. The TRB duties are defined as follows:
a.
The TRB will keep the qualifying activity updated on the status of QML technologies and products.
b.
The TRB will have a methodology in place for assessing and monitoring the quality and reliability of its'
products.
c.
The TRB shall set measurable quality objectives and monitor their progress towards meeting those
objectives.
d.
The TRB is responsible for control of all certified technology families.
e.
The technology families will be defined by the TRB.
f.
A manufacturer can have more than one TRB if appropriate.
g.
The TRB controls all aspects of military product design changes, material changes, and process
changes. The TRB monitors performance of all contract services.
h.
The TRB will approve all process flow charts, failure mode effects analysis (FMEA), and control plans for
each individual process. The TRB determines what test or verifications are needed to prove out
proposed design and construction changes (See table E-IV of appendix E).
i.
The TRB decides what devices (i.e., worst case) shall be used to qualify a new technology family.
j.
The TRB will also address the impact of key personnel changes on the QM system.
k.
The TRB shall maintain records and make them available for qualifying activity review.
l.
The TRB is required to report periodically to the qualifying activity on the status of the QML technology
and products (see C.4.5).
C.4.3 TRB input The TRB shall be provided input in order to monitor the quality of products. Examples of needed
input are: Self-audit results, SPC data, production yields, customer returns, and corrective/preventive action
initiatives. Other TRB responsibilities include, but are not limited to:
a.
Quality improvement initiatives (see C.8.4).
b.
Reliability program results (see.C.8.1.1.1, C.8.1.2, and C.8.4.1).
c.
Qualification test data and process validation review.
d.
Design and process change test data review (see C.7.1).
e.
Reviewing results of failure analysis.
f.
Monitor performance of any contract services.
g.
Monitor customer returns and complaints.
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